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게재일 저자 / 논문명 / 저널명 Vol No. Page
2009.11.13
저자
Sung Ki Cho, Taeho Lim, Hong-Kee Lee, Jae Jeong Kim
논문명
A Study on Seed Damage in Plating Electrolyte and Its Repairing in Cu Damascene Metallization
저널명
Journal of The Electrochemical Society
157 4 D187-192
2009.10.01
저자
Min Cheol Kang, Yung Jun Kim, Hyo-Chol Koo, Sung Ki Cho, Jae Jeong Kim
논문명
Local Corrosion of the Oxide Passivation Layer during Cu Chemical Mechanical Polishing
저널명
Electrochemical and Solid-State Letters
12 12 H433-H436
2009.07.31
저자
Jung Woo Ko, Hyo Chol Koo, Dong Wan Kim, Sung Min Seo, Tae June Kang, Yongjoo Kwon, Jung Lim Yoon, Jun Ho Cheon, Yong Hyup Kim, Jae Jeong Kim, Young June Park
논문명
Electroless Gold Plating on Aluminum Patterned Chips for CMOS-based Sensor Applications
저널명
Journal of The Electrochemical Society
157 1 D46-D49
2009. 07. 22
저자
Sang Hyun Ahn, Oh Joong Kwon, Insoo Choi, Jae Jeong Kim
논문명
Synergetic effect of combined use of Cu?ZnO?Al2O3 and Pt?Al2O3 for the steam reforming of methanol?
저널명
Catalysis Communications
10 2018-2022
2009. 07. 01
저자
Min Cheol Kang, Yung Jun Kim, and Jae Jeong Kim
논문명
In Situ Formation of Ag Capping Layer for Preventing Oxidation in Copper Chemical Mechanical Polishing
저널명
Electrochemical and Solid state Letters
12 9 H340-H343
2009. 05. 29
저자
Jaehui Ahn, Hong-Yeol Kim, Hyo-chol Koo, Jae Jeong Kim, Jihyun Kim
논문명
Characterization and Cu Electroless Plating of Laser-drilled Through-Wafer via-holes in GaN/Al2O3
저널명
Thin Solid Films
517 14 3841?3843?
2009. 05. 12
저자
Hyo-Chol Koo, Sung Ki Cho, Oh Joong Kwon, Myung-Won Suh, Young Im, and Jae Jeong Kim
논문명
Improvement in the Oxidation Resistance of Cu Films by an Electroless Co-Alloy Capping Process
저널명
Journal of The Electrochemical Society
156 7 D236-D241
2009. 04. 21
저자
Chang Hwa Lee, Ae Rim Kim, Hyo-Chol Koo and Jae Jeong Kim
논문명
Effect of 2-Mercapto-5-benzimidazolesulfonic Acid in Superconformal Cu Electroless Deposition
저널명
Journal of The Electrochemical Society
156 6 D207-D210
2009. 01. 15
저자
Sun-Mi Hwang, Oh Joong Kwon, Sang Hyun Ahn and Jae Jeong Kim
논문명
Silicon-based micro-reactor for preferential CO oxidation
저널명
Chemical Engineering Journal
146 105-111
2008. 07. 15
저자
Jeong Gil Seo, Min Hye Youn, Ho-In Lee, Jae Jeong Kim, Eunsun Yang, Jin Suk Chung, Pil Kim and In Kyu Song
논문명
Hydrogen production by steam reforming of liquefied natural gas (LNG) over mesoporous nickel-alumina xerogel catalysts: Effect of nickel content
저널명
Chemical Engineering Journal
141 298-304
2008. 07. 08
저자
Hyo-Chol Koo, Seo Young Kim, Sung Ki Cho and Jae Jeong Kim
논문명
Ag Seed-Layer Formation by Electroless Plating for Ultra-Large-Scale Integration Interconnection
저널명
Journal of The Electrochemical Society
155 9 D558-D562
2008. 07. 01
저자
Oh Joong Kwon, Duk Hyoung Yoon and Jae Jeong Kim
논문명
Silicon-based miniaturized reformer with methanol catalytic burner
저널명
Chemical Engineering Journal
140 466-472
2008. 04. 30
저자
Moo Seong Kang, Soo-Kil Kim, Keeho Kim, and Jae Jeong Kim
논문명
The influence of thiourea on copper electrodeposition: adsorbate identification and effect on electrochemical nucleation
저널명
Thin Solid Films
516 3761-3766
2008. 03. 20
저자
Hyo-Chol Koo, Sung Ki Cho, Chang Hwa Lee, Soo-Kil Kim, Oh Joong Kwon and Jae Jeong Kim
논문명
Silver Direct Electrodeposition on Ru Thin Film
저널명
Journal of The Electrochemical Society
155 5 D389-D394
2008. 01. 02
저자
Hyo-Chol Koo and Jae Jeong Kim
논문명
Effects of Stabilizing Agents on Film Properties in Ag Electroless Plating
저널명
Journal of The Electrochemical Society
155 3 D176-D180
2007. 12. 05
저자
Min Cheol Kang, Ho-Seong Nam, Ho Youn Won, Sukhoon Jeong, Haedo Jeong, and Jae Jeong Kim
논문명
Effects of OH radicals on formation of Cu oxide and polishing performance in Cu Chemical Mechanical Polishing
저널명
Electrochemical and Solid-state Letters
11 2 H32-H35
2007. 11. 14
저자
Chang Hwa Lee, Ae Rim Kim, Soo-Kil Kim, Hyo-Chol Koo, Sung Ki Cho, and Jae Jeong Kim
논문명
Two-step filling in Cu electroless deposition using a concentration-dependent effect of 3-N,N-dimethylaminodithiocarbamoyl-1-propanesulfonic acid
저널명
Electrochemical and Solid-state Letters
11 1 D18-D21
2007. 10. 31
저자
Hyo-Chol Koo, Eung Jin Ahn, and Jae Jeong Kim
논문명
Direct-Electroplating of Ag on Pretreated TiN Surfaces
저널명
Journal of The Electrochemical Society
155 1 D10-D13
2007. 09. 15
저자
Oh Joong Kwon, Sun-Mi Hwang, In Kyu Song, Ho-In Lee and Jae Jeong Kim
논문명
A Silicon-Based Miniaturized Reformer for High Power Electric Devices
저널명
Chemical Engineering Journal
133 157-163
2007. 08. 03
저자
Sung Ki Cho, Jong Kyun Lee, Soo-Kil Kim, and Jae Jeong Kim
논문명
Acceleration Effect of CuCN in Ag Electroplating for Ultralarge-Scale Interconnects
저널명
Electrochemical and Solid-State Letters.
10 10 D116-D119

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