Seoul National University
Electronics Processing
Research Laboratary
  • PUBLICATIONS > Paper > 해외저널

해외저널

PUBLICATIONS > Paper > 해외저널 목록
게재일 저자 / 논문명 / 저널명 Vol No. Page
2006. 10. 09
저자
Sung Ki Cho and Jae Jeong Kim
논문명
Leveling with Step Potential in Damascene Cu Electrodeposition
저널명
Journal of The Electrochemical Society
153 C822-C825
2006. 07. 27
저자
Chang Hwa Lee, Soonsik Hwang, Sang-Chul Kim and Jae Jeong Kim
논문명
Cu Electroless Deposition onto Ta substrates-Application to Create a Seed Layer for Cu Electrodeposition
저널명
Electrochemical and Solid state Letters
9 10 C157-C160
2006. 06. 30.
저자
Hyun-Kon Song, Jong H. Jang, Jae Jeong Kim, Seung M. Oh
논문명
Electrochemical porosimetry: Deconvolution of distribution functions
저널명
Electrochemistry Communications
8 1191-1196
2006. 06. 01.
저자
Oh Joong Kwon, Sun-Mi Hwang, Jin-Goo Ahn and Jae Jeong Kim
논문명
Silicon-based miniaturized-reformer for portable fuel cell applications
저널명
Journal of Power Sources
156 2 253-259
2006. 04. 01.
저자
Jeong Ah Kim, Ji Youn Lee, Shimyoung Seong, Seung Hwan Cha, Jae Jeong Kim, Tai Hyun Park
논문명
Fabrication and characterization of a PDMS-glass hybrid continuous-flow PCR chip
저널명
Biochemical Engineering Journal
29 1-2 91-97
2005. 12. 06
저자
Soo-Kil Kim, Soonsik Hwang, Sung Ki Cho, and Jae Jeong Kim
논문명
Leveling of Superfilled Damascene Cu Film Using Two-Step Electrodeposition
저널명
Electrochemical and Solid-State Letters.
9 2 C25-C28
2005. 11. 09.
저자
Moo Sung Kang, Soo-Kil Kim, Jae Jeong Kim
논문명
A Novel Process to Control the Surface Roughness and Resistivity of Electroplated Cu Using Thiourea
저널명
Japanese Journal of Applied Physics
44 11 8107-8109
2005. 10. 24.
저자
Jong Won Lee, Min Cheol Kang, Jae Jeong Kim
논문명
Charaterization of 5-aminotetrazole (ATRA) as a corrosion inhibitor in copper chemical mechanical polishing
저널명
Journal of The Electrochemical Society
152 12 C827-C831
2005. 09. 22.
저자
Chang Hwa Lee, Sung Ki Cho and Jae Jeong Kim
논문명
Electroless Cu bottom-up filling using 3-N,N-Dimethylaminodithiocarbanmoyl-1-propanesulfonic acid (DPS)
저널명
Electrochemical and Solid-State Letters.
8 11 J27-J29
2005. 09. 16.
저자
Seung Hwan Cha, Seung-Soo Kim, Sung Ki Cho and Jae Jeong Kim
논문명
Bottom up Filling Using Electrical Oxidation on Pattern Wafer
저널명
Electrochemical and Solid-State Letters.
8 11 C170-C172
2005. 08. 05
저자
Min Cheol Kang, Jae Jeong Kim and Doo-Kyung Moon
논문명
Effect of Organic Additives on Ceria Slurry in Shallow Trench Isolation Chemical Mechanical Planarization
저널명
Japanese Journal of Applied Physics
44 8 5949-5952
2005. 06. 07.
저자
Chang Hwa Lee, Sang Chul Lee, Jae Jeong Kim
논문명
Improvement of electrolessly gap-filled Cu using 2,2'-dipyridyl and bis-(3-sulfopropyl)-disulfide (SPS)
저널명
Electrochemical and Solid-State Letters.
8 8 C110-C113
2005. 05. 30
저자
Chang Hwa Lee, Sang Chul Lee and Jae Jeong Kim
논문명
Bottom-up filling in Cu electroless deposition using bis-(3-sulfopropyl)-disulfide (SPS)
저널명
Electrochimica Acta
50 3563-3568
2005. 05. 05.
저자
Seung Hwan Cha , Hyo-Chol Koo and Jae Jeong Kim
논문명
The Inhibition of Silver Agglomeration by Gold Activation in Silver Electroless Plating
저널명
Journal of The Electrochemical Society
152 6 C388-C391
2005. 04. 07
저자
Sung Ki Cho, Soo-Kil Kim, Jae Jeong Kim
논문명
Superconformal Cu electrodeposition using DPS; A substitutive accelerator for SPS
저널명
Journal of The Electrochemical Society
152 5 C330-C333
2005. 03. 11.
저자
Chang Hwa Lee and Jae Jeong Kim
논문명
Effects of Pd activation on the self annealing of electroless copper deposition using Co(II)-ethylenediamine as a reducing agent
저널명
The Journal of Vacuum Science and Technology B
23 2 475~479
2004. 11. 29.
저자
Soo-Kil Kim, Sung Ki Cho, Jae Jeong Kim, and Young-Soo Lee
논문명
Superconformal Cu Electrodeposition on Various Substrates
저널명
Electrochemical and Solid-State Letters.
8 1 C19~C21
2004. 11. 04.
저자
Sung Ki Cho, Soo-Kil Kim, Hee Han, Jae Jeong Kim, and Seung Mo Oh
논문명
Damascene Cu electrodeposition on metal organic chemical vapor deposition-grown Ru film barrier
저널명
The Journal of Vacuum Science and Technology B
22 6 2649~2653
2004. 09. 07
저자
Eung Jin Ahn and Jae Jeong Kim
논문명
Additives for Super-conformal Electroplating of Ag Thin Film for ULSI
저널명
Electrochemical and Solid-State Letters.
7 10 C118~C120
2004. 08. 04.
저자
Soo-Kil Kim and Jae Jeong Kim
논문명
Additive-free Superfilling in Damascene Cu Electrodeposition using Microcontact Printing
저널명
Electrochemical and Solid-State Letters.
7 9 C101~C103

COPYRIGHT © 2008~2016 SNU CBE Mipro, ALL RIGHTS RESERVED.