Seoul National University
Electronics Processing
Research Laboratary
  • PUBLICATIONS > Paper > 해외저널

해외저널

PUBLICATIONS > Paper > 해외저널 목록
게재일 저자 / 논문명 / 저널명 Vol No. Page
2006. 07. 27
저자
Chang Hwa Lee, Soonsik Hwang, Sang-Chul Kim and Jae Jeong Kim
논문명
Cu Electroless Deposition onto Ta substrates-Application to Create a Seed Layer for Cu Electrodeposition
저널명
Electrochemical and Solid state Letters
9 10 C157-C160
2006. 06. 30.
저자
Hyun-Kon Song, Jong H. Jang, Jae Jeong Kim, Seung M. Oh
논문명
Electrochemical porosimetry: Deconvolution of distribution functions
저널명
Electrochemistry Communications
8 1191-1196
2006. 06. 01.
저자
Oh Joong Kwon, Sun-Mi Hwang, Jin-Goo Ahn and Jae Jeong Kim
논문명
Silicon-based miniaturized-reformer for portable fuel cell applications
저널명
Journal of Power Sources
156 2 253-259
2006. 04. 01.
저자
Jeong Ah Kim, Ji Youn Lee, Shimyoung Seong, Seung Hwan Cha, Jae Jeong Kim, Tai Hyun Park
논문명
Fabrication and characterization of a PDMS-glass hybrid continuous-flow PCR chip
저널명
Biochemical Engineering Journal
29 1-2 91-97
2005. 12. 06
저자
Soo-Kil Kim, Soonsik Hwang, Sung Ki Cho, and Jae Jeong Kim
논문명
Leveling of Superfilled Damascene Cu Film Using Two-Step Electrodeposition
저널명
Electrochemical and Solid-State Letters.
9 2 C25-C28
2005. 11. 09.
저자
Moo Sung Kang, Soo-Kil Kim, Jae Jeong Kim
논문명
A Novel Process to Control the Surface Roughness and Resistivity of Electroplated Cu Using Thiourea
저널명
Japanese Journal of Applied Physics
44 11 8107-8109
2005. 10. 24.
저자
Jong Won Lee, Min Cheol Kang, Jae Jeong Kim
논문명
Charaterization of 5-aminotetrazole (ATRA) as a corrosion inhibitor in copper chemical mechanical polishing
저널명
Journal of The Electrochemical Society
152 12 C827-C831
2005. 09. 22.
저자
Chang Hwa Lee, Sung Ki Cho and Jae Jeong Kim
논문명
Electroless Cu bottom-up filling using 3-N,N-Dimethylaminodithiocarbanmoyl-1-propanesulfonic acid (DPS)
저널명
Electrochemical and Solid-State Letters.
8 11 J27-J29
2005. 09. 16.
저자
Seung Hwan Cha, Seung-Soo Kim, Sung Ki Cho and Jae Jeong Kim
논문명
Bottom up Filling Using Electrical Oxidation on Pattern Wafer
저널명
Electrochemical and Solid-State Letters.
8 11 C170-C172
2005. 08. 05
저자
Min Cheol Kang, Jae Jeong Kim and Doo-Kyung Moon
논문명
Effect of Organic Additives on Ceria Slurry in Shallow Trench Isolation Chemical Mechanical Planarization
저널명
Japanese Journal of Applied Physics
44 8 5949-5952
2005. 06. 07.
저자
Chang Hwa Lee, Sang Chul Lee, Jae Jeong Kim
논문명
Improvement of electrolessly gap-filled Cu using 2,2'-dipyridyl and bis-(3-sulfopropyl)-disulfide (SPS)
저널명
Electrochemical and Solid-State Letters.
8 8 C110-C113
2005. 05. 30
저자
Chang Hwa Lee, Sang Chul Lee and Jae Jeong Kim
논문명
Bottom-up filling in Cu electroless deposition using bis-(3-sulfopropyl)-disulfide (SPS)
저널명
Electrochimica Acta
50 3563-3568
2005. 05. 05.
저자
Seung Hwan Cha , Hyo-Chol Koo and Jae Jeong Kim
논문명
The Inhibition of Silver Agglomeration by Gold Activation in Silver Electroless Plating
저널명
Journal of The Electrochemical Society
152 6 C388-C391
2005. 04. 07
저자
Sung Ki Cho, Soo-Kil Kim, Jae Jeong Kim
논문명
Superconformal Cu electrodeposition using DPS; A substitutive accelerator for SPS
저널명
Journal of The Electrochemical Society
152 5 C330-C333
2005. 03. 11.
저자
Chang Hwa Lee and Jae Jeong Kim
논문명
Effects of Pd activation on the self annealing of electroless copper deposition using Co(II)-ethylenediamine as a reducing agent
저널명
The Journal of Vacuum Science and Technology B
23 2 475~479
2004. 11. 29.
저자
Soo-Kil Kim, Sung Ki Cho, Jae Jeong Kim, and Young-Soo Lee
논문명
Superconformal Cu Electrodeposition on Various Substrates
저널명
Electrochemical and Solid-State Letters.
8 1 C19~C21
2004. 11. 04.
저자
Sung Ki Cho, Soo-Kil Kim, Hee Han, Jae Jeong Kim, and Seung Mo Oh
논문명
Damascene Cu electrodeposition on metal organic chemical vapor deposition-grown Ru film barrier
저널명
The Journal of Vacuum Science and Technology B
22 6 2649~2653
2004. 09. 07
저자
Eung Jin Ahn and Jae Jeong Kim
논문명
Additives for Super-conformal Electroplating of Ag Thin Film for ULSI
저널명
Electrochemical and Solid-State Letters.
7 10 C118~C120
2004. 08. 04.
저자
Soo-Kil Kim and Jae Jeong Kim
논문명
Additive-free Superfilling in Damascene Cu Electrodeposition using Microcontact Printing
저널명
Electrochemical and Solid-State Letters.
7 9 C101~C103
2004. 08. 04.
저자
Soo-Kil Kim and Jae Jeong Kim
논문명
Superfilling Evolution in Cu Electrodeposition; Dependence on the Aging Time of the Accelerator
저널명
Electrochemical and Solid-State Letters.
7 9 C98~C100

COPYRIGHT © 2008~2016 SNU CBE Mipro, ALL RIGHTS RESERVED.