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게재일 저자 / 논문명 / 저널명 Vol No. Page
2004. 08. 04.
저자
Soo-Kil Kim and Jae Jeong Kim
논문명
Superfilling Evolution in Cu Electrodeposition; Dependence on the Aging Time of the Accelerator
저널명
Electrochemical and Solid-State Letters.
7 9 C98~C100
2004. 05. 24.
저자
Hee Han, Jae Jeong Kim and Do Young Yoon
논문명
Pretreatment technique for surface improvement of Ru films in Ru-metalorganic chemical vapor deposition
저널명
The Journal of Vacuum Science and Technology A
22 4 1120-1123
2004. 01. 20.
저자
Chang Hwa Lee and Jae Jeong Kim
논문명
Self-annealing effect of electrolessly deposited copper thin films based on Co(II)-ethylenediamine as a reducing agent
저널명
The Journal of Vacuum Science and Technology B
22 1 180~184
2004. 01. 09.
저자
Oh Joong Kwon, Seung Hwan Cha, and Jae Jeong Kim
논문명
Ruthenium Bottom Electrode Prepared by Electroplating for a High-density DRAM Capacitor
저널명
Journal of the Electrochemical Society
151 2 C127-C132
2003. 12. 09.
저자
Jae Jeong Kim, Soo-Kil Kim, and Yong Shik Kim
논문명
Direct Plating of Low Resistivity Bright Cu Films onto TiN Barrier Layer via Pd Activation
저널명
Journal of the Electrochemical Society
151 1 C97~C101
2003. 09. 15
저자
Jae Jeong Kim, Soo-Kil Kim, and Young Shik Kim
논문명
A Novel Method for Cu Electrodeposition on Indium Tin Oxide Aided by Two-Step Sn-Pd activation
저널명
Japanese Journal of Applied Physics
42 Part 2, No. 9A/B L1080-L1082
2003. 08. 01
저자
Jae Jeong Kim, Seung Hwan Cha, and Young-Soo Lee
논문명
Seedless Fill - up of the Damascene Structure Only by Copper Electroless Plating
저널명
Japanese Journal of Applied Physics
42 Part 2, No. 8A L953-L955
2003. 01. 30.
저자
Jae Jeong Kim, Soo-Kil Kim, Yong Shik Kim
논문명
catalytic behavior of MPSA(3-mercapto-1-propane sulfonic acid) on Cu electrodeposition and its effect on Cu film properties for CMOS device metallization.
저널명
Journal of Electroanalytical Chemistry
542 61-66
2003. 01.
저자
Jae Jeong Kim, Moon Soo Kim, Do Young Yoon
논문명
Effects of an added iodine source (C2H5I) on Ru Metalorganic Chemical Vapor Deposition
저널명
Chemical vapor deposition
9 2 105-109
2002. 12. 16.
저자
Jae Jeong Kim, Soo-Kil Kim, Chang Hwa Lee, and Yong Shik Kim
논문명
Investigation of various copper seed layers for copper electrodeposition applicable to ultralarge-scale integration interconnection
저널명
The Journal of Vacuum Science and Technology B
21 1 33-38
2002. 12. 10
저자
Jae Jeong Kim, Yong Shik Kim, and Soo-Kil Kim
논문명
Oxidation Resistive Cu Films by Room Temperature Surface Passivation with Thin Ag Layer
저널명
Electrochemical and Solid-State Letters.
6 2 C17-C20
2002. 11
저자
Jae Jeong Kim,Seung Hwan Cha
논문명
Optimized Surface Treatment of Indium Tin Oxide (ITO) for Copper Electroless Plating
저널명
Japanese Journal of Applied Physics
41 11A L1269-L1271
2002. 08
저자
Jae Jeong Kim, Soo-Kil Kim, and Jong-Uk Bae
논문명
Investigation of Copper Deposition in the Presence of Benzotriazole
저널명
Thin Solid Films
415 101-107
2002. 04
저자
Jae Jeong Kim, Doo Hwan Jung, Moon Soo Kim, Sang Hyun Kim, Do Young Yoon
논문명
Surface Roughness Reducing Effect of Iodine Sources (CH3I, C2H5I) on Ru and RuO2 Composite Films Grown by MOCVD
저널명
Thin Solid Films
409 28-32
2002. 02.
저자
Jae Jeong Kim, Jun Yong Kim, Chae Ho Jeong, Nae Hak Park, Sang Bum Han, Jin Won Park, Won-Jun Lee
논문명
Corrosion in Aluminum Chemical Mechanical Planarization for Sub-Quarter Micron Dynamic Random Access Memory Devices
저널명
Japanese Journal of Applied Physics
41 2A (part 1) 925-929
2001. 12.
저자
Jae Jeong Kim, Seung Hwan Cha
논문명
Optimized Surface Pre-treatments for Cu Electroless Plating in ULSI Device Interconnection
저널명
Japanese Journal of Applied Physics
40 12 7151-7155
2001. 12.
저자
Jae Jeong Kim, Soo-Kil Kim
논문명
Optimized Surface Pretreatments for Copper Electroplating
저널명
Applied Surface Science
183 311-318
2001. 11. 15
저자
Jong-Uk Bae, Dong Kyun Sohn, Ji-Soo Park, Chang Hee Han, Jin Won Park, Yeong-Cheol Kim, Jae Jeong Kim
논문명
A Study on Thermal Stability of CoSi2 Employing Novel Fine-Grained Polycrystalline Silicon/CoSi2/Si(001) System
저널명
Japanese Journal of Applied Physics
40 11 6307-6310
1999. 06.
저자
Jeong Soo Byun, Byung Hak Lee, Ji-Soo Park, Dong Kyun Sohn, J. Hong, W-J. Cho, Sang Jun Choi, and Jae Jeong Kim
논문명
Reduction of Dichlorosilane-Based Tungsten Silicide Resistivity by Amorphization and Its Applicability as an Electrode
저널명
Journal of the Electrochemical Society
146 6 2261-2269
1999. 02.
저자
Jae-Hyun Joo, Jong-Bum Park, Younsoo Kim, Kong-Soo Lee, Jun-Sik Lee, Jae-Sung Roh and Jae-Jeong Kim
논문명
Low Temperature Chemical Vapor Deposition of (Ba, Sr)TiO3 Thin Films for High Density Dynamic Random Access Memory Capacitors
저널명
Japanese Journal of Applied Physics
38 2B L195-L198

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