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게재일 저자 / 논문명 / 저널명 Vol No. Page
2005. 05. 05.
저자
Seung Hwan Cha , Hyo-Chol Koo and Jae Jeong Kim
논문명
The Inhibition of Silver Agglomeration by Gold Activation in Silver Electroless Plating
저널명
Journal of The Electrochemical Society
152 6 C388-C391
2005. 04. 07
저자
Sung Ki Cho, Soo-Kil Kim, Jae Jeong Kim
논문명
Superconformal Cu electrodeposition using DPS; A substitutive accelerator for SPS
저널명
Journal of The Electrochemical Society
152 5 C330-C333
2005. 03. 11.
저자
Chang Hwa Lee and Jae Jeong Kim
논문명
Effects of Pd activation on the self annealing of electroless copper deposition using Co(II)-ethylenediamine as a reducing agent
저널명
The Journal of Vacuum Science and Technology B
23 2 475~479
2004. 11. 29.
저자
Soo-Kil Kim, Sung Ki Cho, Jae Jeong Kim, and Young-Soo Lee
논문명
Superconformal Cu Electrodeposition on Various Substrates
저널명
Electrochemical and Solid-State Letters.
8 1 C19~C21
2004. 11. 04.
저자
Sung Ki Cho, Soo-Kil Kim, Hee Han, Jae Jeong Kim, and Seung Mo Oh
논문명
Damascene Cu electrodeposition on metal organic chemical vapor deposition-grown Ru film barrier
저널명
The Journal of Vacuum Science and Technology B
22 6 2649~2653
2004. 09. 07
저자
Eung Jin Ahn and Jae Jeong Kim
논문명
Additives for Super-conformal Electroplating of Ag Thin Film for ULSI
저널명
Electrochemical and Solid-State Letters.
7 10 C118~C120
2004. 08. 04.
저자
Soo-Kil Kim and Jae Jeong Kim
논문명
Additive-free Superfilling in Damascene Cu Electrodeposition using Microcontact Printing
저널명
Electrochemical and Solid-State Letters.
7 9 C101~C103
2004. 08. 04.
저자
Soo-Kil Kim and Jae Jeong Kim
논문명
Superfilling Evolution in Cu Electrodeposition; Dependence on the Aging Time of the Accelerator
저널명
Electrochemical and Solid-State Letters.
7 9 C98~C100
2004. 05. 24.
저자
Hee Han, Jae Jeong Kim and Do Young Yoon
논문명
Pretreatment technique for surface improvement of Ru films in Ru-metalorganic chemical vapor deposition
저널명
The Journal of Vacuum Science and Technology A
22 4 1120-1123
2004. 01. 20.
저자
Chang Hwa Lee and Jae Jeong Kim
논문명
Self-annealing effect of electrolessly deposited copper thin films based on Co(II)-ethylenediamine as a reducing agent
저널명
The Journal of Vacuum Science and Technology B
22 1 180~184
2004. 01. 09.
저자
Oh Joong Kwon, Seung Hwan Cha, and Jae Jeong Kim
논문명
Ruthenium Bottom Electrode Prepared by Electroplating for a High-density DRAM Capacitor
저널명
Journal of the Electrochemical Society
151 2 C127-C132
2003. 12. 09.
저자
Jae Jeong Kim, Soo-Kil Kim, and Yong Shik Kim
논문명
Direct Plating of Low Resistivity Bright Cu Films onto TiN Barrier Layer via Pd Activation
저널명
Journal of the Electrochemical Society
151 1 C97~C101
2003. 09. 15
저자
Jae Jeong Kim, Soo-Kil Kim, and Young Shik Kim
논문명
A Novel Method for Cu Electrodeposition on Indium Tin Oxide Aided by Two-Step Sn-Pd activation
저널명
Japanese Journal of Applied Physics
42 Part 2, No. 9A/B L1080-L1082
2003. 08. 01
저자
Jae Jeong Kim, Seung Hwan Cha, and Young-Soo Lee
논문명
Seedless Fill - up of the Damascene Structure Only by Copper Electroless Plating
저널명
Japanese Journal of Applied Physics
42 Part 2, No. 8A L953-L955
2003. 01. 30.
저자
Jae Jeong Kim, Soo-Kil Kim, Yong Shik Kim
논문명
catalytic behavior of MPSA(3-mercapto-1-propane sulfonic acid) on Cu electrodeposition and its effect on Cu film properties for CMOS device metallization.
저널명
Journal of Electroanalytical Chemistry
542 61-66
2003. 01.
저자
Jae Jeong Kim, Moon Soo Kim, Do Young Yoon
논문명
Effects of an added iodine source (C2H5I) on Ru Metalorganic Chemical Vapor Deposition
저널명
Chemical vapor deposition
9 2 105-109
2002. 12. 16.
저자
Jae Jeong Kim, Soo-Kil Kim, Chang Hwa Lee, and Yong Shik Kim
논문명
Investigation of various copper seed layers for copper electrodeposition applicable to ultralarge-scale integration interconnection
저널명
The Journal of Vacuum Science and Technology B
21 1 33-38
2002. 12. 10
저자
Jae Jeong Kim, Yong Shik Kim, and Soo-Kil Kim
논문명
Oxidation Resistive Cu Films by Room Temperature Surface Passivation with Thin Ag Layer
저널명
Electrochemical and Solid-State Letters.
6 2 C17-C20
2002. 11
저자
Jae Jeong Kim,Seung Hwan Cha
논문명
Optimized Surface Treatment of Indium Tin Oxide (ITO) for Copper Electroless Plating
저널명
Japanese Journal of Applied Physics
41 11A L1269-L1271
2002. 08
저자
Jae Jeong Kim, Soo-Kil Kim, and Jong-Uk Bae
논문명
Investigation of Copper Deposition in the Presence of Benzotriazole
저널명
Thin Solid Films
415 101-107

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