| 2007. 04. 10 |
| 발표자 |
Jae Jeong Kim, Sung Ki Cho
|
| 제목 |
Advanced Cu Electrodeposition Technology for Next Generation Damascene Metallization
|
| 학회명 |
2007 MRS spring meeing
|
|
| 2006. 11. 16 |
| 발표자 |
Oh Joong Kwon, Jun-Yeop Kim, Jae Jeong Kim
|
| 제목 |
Miniaturized reformer and fuel cell system composed with silicon reactors
|
| 학회명 |
Fuel Cell Seminar 2006
|
|
| 2006. 11. 15. |
| 발표자 |
Oh Joong Kwon, Sun-Mi Hwang, Je Hyun Chae, Jae Jeong Kim
|
| 제목 |
The fabrication and the study of a miniature PEM fuel cell with silicon separators
|
| 학회명 |
Fuel Cell Seminar 2006
|
|
| 2006. 05. 09 |
| 발표자 |
Hyo-Chol Koo, Jae Jeong Kim
|
| 제목 |
Silver Direct Electrodeposition on Ru Thin Film
|
| 학회명 |
209th Meeting of ECS
|
|
| 2006. 05. 08 |
| 발표자 |
Jae Jeong Kim, Chang Hwa Lee, Ae Rim Kim, Seo-Young Kim, Sangchul Kim
|
| 제목 |
Electroless Deposition of Cu and Ag For ULSI Interconnect Fabrication
|
| 학회명 |
209th Meeting of ECS
|
|
| 2005. 10. 18 |
| 발표자 |
Sun-mi Hwang, Oh Joong Kwon, Jun-Yeop Kim Jae Jeong Kim
|
| 제목 |
Miniaturized Fuel Cell and Reforming System Based on Silicon Technology
|
| 학회명 |
208th Meeting of ECS
|
|
| 2005. 10. 17 |
| 발표자 |
Sung Ki Cho, Jae Jeong Kim
|
| 제목 |
Leveling with the step potential in damascene Cu electrodeposition
|
| 학회명 |
208th Meeting of ECS
|
|
| 2005. 10. 04 |
| 발표자 |
Chang Hwa Lee, Sung Ki Cho, Jae Jeong Kim
|
| 제목 |
Bottom-up Filling Using Organic Additives in Copper Electroless Deposition
|
| 학회명 |
22nd VMIC conference
|
|
| 2005. 09. 27 |
| 발표자 |
Oh Joong Kwon, Jae Jeong Kim, Sun-Mi Hwang, Jun Yeop Kim
|
| 제목 |
Miniaturized Reformer - Fuel Cell System Based on Silicon Technology
|
| 학회명 |
56th Annual Meeting of the International Society of Electrochemistry
|
|
| 2005. 09. 27 |
| 발표자 |
Jae Jeong Kim, Sung Ki Cho, Soonsik Hwang
|
| 제목 |
Damascene Cu Electrodeposition for Advanced Metallization
|
| 학회명 |
56th Annual Meeting of the International Society of Electrochemistry
|
|
| 2005. 05. 17 |
| 발표자 |
Jong Won Lee, Min Cheol Kang, Jae Jeong Kim
|
| 제목 |
Characterization of 5-aminotetrazole (ATRA) as a Corrosion Inhibitor in Copper Chemical Mechanical Polishing
|
| 학회명 |
207th Meeting of ECS
|
|
| 2005. 05. 17 |
| 발표자 |
Min Cheol Kang, Jong Won Lee, Jae Jeong Kim
|
| 제목 |
The Effect of Organic Additives on Corrosion in Cu Chemical Mechanical Polishing
|
| 학회명 |
207th Meeting of ECS
|
|
| 2004. 10. 22 |
| 발표자 |
Soo-Kil Kim, Sung Ki Cho, Jae Jeong Kim
|
| 제목 |
Fabrication of Cu Interconnection on the Various Substrates Using Defect-free Electrodeposition
|
| 학회명 |
6th Japan-Korea Symposium on Materials & Interfaces
|
|
| 2004. 10. 17 |
| 발표자 |
Soo-Kil Kim, Jae Jeong Kim
|
| 제목 |
Superconformal Cu Electrodeposition for Microelectronics Using Microcontact Printing
|
| 학회명 |
10th APCChE Congress
|
|
| 2004. 10. 07 |
| 발표자 |
Hyo-Chol Koo, Jae Jeong Kim
|
| 제목 |
Electroless deposited silver thin film and its properties
|
| 학회명 |
206th Meeting of ECS
|
|
| 2004. 10. 06 |
| 발표자 |
Seung Hwan Cha, Chang Hwa Lee, Jae Jeong Kim
|
| 제목 |
Pretreatment for Copper Electroless Plating on Taltalum Substrate
|
| 학회명 |
206th Meeting of ECS
|
|
| 2004. 05. 11 |
| 발표자 |
Oh Joong Kwon, Jin-Goo Ahn, Sun-Mi Hwang, Jae Jeong Kim
|
| 제목 |
Micro Steam Reformer Manufactured by Silicon Microfabrication Technology
|
| 학회명 |
205th Meeting of ECS
|
|
| 2004. 05. 10 |
| 발표자 |
Chang Hwa Lee, Sang Chul Lee, Jae Jeong Kim
|
| 제목 |
Bottom-up Filling in Cu Electroless Deposition Using Bis-(3-sulfopropyl)-disulfide (SPS)
|
| 학회명 |
205th Meeting of ECS
|
|
| 2003. 10. 13 |
| 발표자 |
Eung Jin Ahn and Jea Jeong Kim
|
| 제목 |
New Additives for Superconformal Electroplating of Ag Thin Film for ULSI
|
| 학회명 |
204th Meeting of ECS
|
|
| 2003. 05. 23 |
| 발표자 |
Han Hee and Jae Jeong Kim
|
| 제목 |
New pretreatment technique for surface improvement of Ru films in Ru-MOCVD
|
| 학회명 |
Korea-Japan Symposium on Materials
|
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