| 2009-07-09 |
등록 |
7,545,043(미) |
Device comprising multi-layered thin film having excellent adhesive strength and method for fabricating the same |
| 2008-08-05 |
등록? |
7,407,636(미)? |
Reformer for fuel cell system and method of manufacturing reaction substrate used for the same |
| 2007-04-19 |
출원? |
20070087935(미)? |
Micro reforming reactor for fuel cell and method of preparing the same |
| 2005-02-22 |
등록? |
6,858,479 (B2),(미)? |
Low resistivity copper conductor line, liquid crystal display device having the same and method for forming the same |
| 2004-10-19 |
등록? |
6,806,189 (B2), (미)? |
Method of silver (Ag) electroless plating on ITO electrode |
| 2004-09-28 |
등록? |
6,797,135 (B2), (미)? |
Electroplating Apparatus |
| 2004-04-16 |
등록? |
6,706,628 (B2), (미)? |
Method for forming thin film and method for fabricating liquid crystal display using the same |
| 2003-10-28 |
등록? |
6,637,443 (B2), (미)? |
Semiconductor wafer cleaning apparatus and method |
| 2003-03-18 |
등록? |
6,532,976 (B1), (미)? |
Semiconductor wafer cleaning apparatus |
| 2002-12-30 |
출원? |
10/330,431 (미)? |
Method of silver (Ag) electroless plating on ITO electrode |
| 2002-12-30 |
출원? |
10/323,946 (미)? |
Low resistivity copper conductor line, liquid crystal display device having the same and method for forming the same |
| 2002-12-23 |
출원? |
10/326,486 (미)? |
Semiconductor wafer cleaning apparatus and method |
| 2002-04-16 |
등록? |
6,372,116 (B1), (미)? |
A method of forming a conductive layer and an electroplatng apparatus thereof |
| 2002-03-06 |
출원? |
10/090,753 (미)? |
Electroplating Apparatus |
| 2001-11-02 |
출원? |
09/985,342 (미)? |
Method for forming thin film and method for fabricating liquid crystal display using the same |
| 1999-11-16 |
등록? |
5,985,125 (미)? |
Selective copper deposition method |
| 1999-09-15 |
출원? |
09/396,202 (미)? |
A method of forming a conductive layer and an electroplatng apparatus thereof |
| 1999-04-23 |
등록? |
2916616 (일)? |
System and method for cleaning a semiconductor wafer |
| 1999-02-23 |
등록? |
5,873,948 (미)? |
Method for removing etch residue material |
| 1998-09-04 |
등록? |
2821869 (일)? |
Selective copper deposition method |
