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PUBLICATIONS > Patent > 국제특허 목록
일자 구분 출원/등록번호 발명의 명칭
2009-07-09 등록 7,545,043(미) Device comprising multi-layered thin film having excellent adhesive strength and method for fabricating the same
2008-08-05 등록? 7,407,636(미)? Reformer for fuel cell system and method of manufacturing reaction substrate used for the same
2007-04-19 출원? 20070087935(미)? Micro reforming reactor for fuel cell and method of preparing the same
2005-02-22 등록? 6,858,479 (B2),(미)? Low resistivity copper conductor line, liquid crystal display device having the same and method for forming the same
2004-10-19 등록? 6,806,189 (B2), (미)? Method of silver (Ag) electroless plating on ITO electrode
2004-09-28 등록? 6,797,135 (B2), (미)? Electroplating Apparatus
2004-04-16 등록? 6,706,628 (B2), (미)? Method for forming thin film and method for fabricating liquid crystal display using the same
2003-10-28 등록? 6,637,443 (B2), (미)? Semiconductor wafer cleaning apparatus and method
2003-03-18 등록? 6,532,976 (B1), (미)? Semiconductor wafer cleaning apparatus
2002-12-30 출원? 10/330,431 (미)? Method of silver (Ag) electroless plating on ITO electrode
2002-12-30 출원? 10/323,946 (미)? Low resistivity copper conductor line, liquid crystal display device having the same and method for forming the same
2002-12-23 출원? 10/326,486 (미)? Semiconductor wafer cleaning apparatus and method
2002-04-16 등록? 6,372,116 (B1), (미)? A method of forming a conductive layer and an electroplatng apparatus thereof
2002-03-06 출원? 10/090,753 (미)? Electroplating Apparatus
2001-11-02 출원? 09/985,342 (미)? Method for forming thin film and method for fabricating liquid crystal display using the same
1999-11-16 등록? 5,985,125 (미)? Selective copper deposition method
1999-09-15 출원? 09/396,202 (미)? A method of forming a conductive layer and an electroplatng apparatus thereof
1999-04-23 등록? 2916616 (일)? System and method for cleaning a semiconductor wafer
1999-02-23 등록? 5,873,948 (미)? Method for removing etch residue material
1998-09-04 등록? 2821869 (일)? Selective copper deposition method
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