2018.05.17 |
발표자 |
Y. Ham, M. J. Kim, T. Lim, S. K. Kim, J. J. Kim
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제목 |
Electrodeposition of Ag Catalyst for Electrochemical CO2 Reduction
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학회명 |
233rd ECS meeting
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2018.05.15 |
발표자 |
Y. Jeon, M. J. Kim, S. Choe, H. C. Kim, J. J. Kim
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제목 |
Fabrication of Cu-Ag Film by Electrodeposition in Ammonia-based Electrolyte
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학회명 |
233rd ECS meeting
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2018.05.15 |
발표자 |
S. Baek, H. Kim, K. H. Kim, O. S. Kwon, O. J. Kwon, J. J. Kim
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제목 |
Electrochemical reduction of greenhouse gas with Couette-Taylor vortex reaction
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학회명 |
233rd ECS meeting
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2018.05.14 |
발표자 |
B. K. KIm, S. K. Kim, S. K. Cho, J. J. Kim
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제목 |
Effect of Alloying on Electrodeposited Ni Electrocatalyst for Oxygen Evolution Reaction
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학회명 |
233rd ECS meeting
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2017.10.04 |
발표자 |
M. J. Kim, P. F. Flowers, I. E. Stewart, S. Ye (Duke University), S. Baek, J. J. Kim (Seoul National University), and B. J. Wiley (Duke University)
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제목 |
A Single-Crystal Electrochemical Study of the Facet-Selective Chemistry That Drives Anisotropic Growth of Cu Nanowires
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학회명 |
232th ECS meeting
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2017.08.30 |
발표자 |
Tae Young Kim, Seoung Hoe Choe, Hoe Chul Kim, Yu Seok Ham and Jae Jeoung Kim
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제목 |
“Effect of Electrolyte Acidity on the SPS Decomposition in Cu Electrodeposition?
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학회명 |
ISE Annual Meeting 2017
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2017.08.30 |
발표자 |
Minjae Sung, Yu Seok Ham, Young Yoon, TaeHo Lim, and Jae Jeong Kim
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제목 |
Grain size-controlled filling of Through silicon via
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학회명 |
ISE Annual Meeting 2017
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2017.08.30 |
발표자 |
Myung Hyun Lee, Yu Seok Ham, Sung Ki Cho, and Jae Jeong Kim
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제목 |
The influence of the synergistic inhibition between suppressor and halide ion for void-free filling in micro via filling
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학회명 |
ISE Annual Meeting 2017
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2017.08.30 |
발표자 |
Jin Uk Byun, Sang Hyun Ahn, and Jae Jeong Kim
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제목 |
Self-terminating electrodeposition of atomic scale platinum film on titanium nitride as an electrochemical catalyst
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학회명 |
ISE Annual Meeting 2017
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2016.10.05 |
발표자 |
S. Baek, M. J. Kim, K. H. Kim, and J. J. Kim
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제목 |
One-Step Fabrication of Whisker Catalyst By Galvanic Displacement Reaction and Its Application As the Electrocatalyst
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학회명 |
PRiME 2016
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2016.10.05 |
발표자 |
M. Kim, I. Choi, M. J. Kim, and J. J. Kim
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제목 |
The Structure Modification of Substrate for Alloying Materials in Li-Ion Secondary Battery
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학회명 |
PRiME 2016
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2016.04.18 |
발표자 |
Yu Seok Ham, Seunghoe Choe, Myung Jun Kim, Hoe Chul Kim, Soo-Kil Kim, Jae Jeong Kim
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제목 |
Fabrication of porous Au-Ag bimetallic electrocatalyst synthesized via electrodeposition for CO2 reduction
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학회명 |
19th Topical Meeting of the International Socitety of Electrochemistry
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2016.04.18 |
발표자 |
Hoe Chul Kim, Seunghoe Choe, Myung Jun Kim, Young Gyu Kim, Jae Jeong Kim, Yoonjae Lee, Youngran Seo
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제목 |
Bottom-up Filling of Through Silicon Vias Based on Electrochemically Derived Filling Mechanism with Ammonium-Containing levelers
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학회명 |
19th Topical Meeting of the International Socitety of Electrochemistry
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2014.10.07 |
발표자 |
Myeongho Kim, Kyung Ju Park, Kang Uk Lee, Myung Jun Kim, Oh Joong Kwon, and Jae Jeong Kim
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제목 |
Black Pigment Preparation VIa Couette-Taylor Vortex for Electrophoretic Display Application
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학회명 |
226th ECS meeting
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2014.10.07 |
발표자 |
Seunghoe Choe, Myung Jun Kim, Kwang Hwan Kim, Heo Chul Kim, Anna Lee, Soo-Kil Kim, and Jae Jeong Kim
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제목 |
Degradation of Organic Additives and Its Influences on Cu Electrodepostion
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학회명 |
226th ECS meeting
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2014.10.07 |
발표자 |
Jae Jeong Kim, Myung Jun Kim, Seunghoe Choe, Kwang Hwan Kim, Heo Chul Kim, and Anna Lee
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제목 |
Recent Progress in Cu Electrodeposition for TSV(Through Silicon Via)
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학회명 |
226th ECS meeting
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2014.10.07 |
발표자 |
Youngkwang Kim, Kanghoon Kim, Insoo Choi, Jae Jeong Kim, and Oh Joon Kwon
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제목 |
The Application of Ultrasound to the Coating of Platinum Catalyst on Membrane for Proton Exchange Membrane Fule Cell
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학회명 |
226th ECS meeting
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2014.10.07 |
발표자 |
Hyung Joon Lee, Kanghoon Kim, Jae Jeong Kim, and Oh Joong Kwon
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제목 |
Sonochemical Synthesis of Platinum Catalysts Supported on Carbonized
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학회명 |
226th ECS meeting
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2014.07.01 |
발표자 |
함유석, 김명준, 최지희, 김수길, 김재정?
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제목 |
Fabrication of Au Catalyst for electrochemical reduction of CO2 to syngas
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학회명 |
Nano Korea 2015
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2014.05.13 |
발표자 |
Hoe Chul Kim, Myung Jun Kim, Seunghoe Choe, Ji Yoon Cho, Donghyung Lee, Il Jung, Won-Seob Cho, and Jae Jeong Kim
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제목 |
Bottom-up through Silicon Via Filling Using Galvanostatic Cu Electrodeposition with Three-Additive Chemistry
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학회명 |
225th ECS Meeting
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