Seoul National University
Electronics Processing
Research Laboratary
  • INTRODUCTION > ResearchFields > Electrodeposition

Electrodeposition

Electrodeposition for fabrication the interconnections

 

 


 

 

Gap-filling with organic additives

The Mechanism of Bottom-up Filling (Superfilling)

 

 

Cu Electrodeposition

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?Ag Electrodeposition

 

?Through Silicon Via (TSV) Filling for 3D Package (Pulse-Reverse Deposition with Leveler)

 

 

 

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Film property improvements using pulse deposition

Pulse Deposition

 

Film Resistivity Improvements using Pulse Deposition


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