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게재일 저자 / 논문명 / 저널명 Vol No. Page
2016.07
저자
Myung Jun Kim, Hoe Chul Kim, Jae Jeong Kim
논문명
The In?uences of Iodide Ion on Cu Electrodeposition and TSV Filling?
저널명
Journal of The Electrochemical Society
163 8 D434-D441
2016.07
저자
Sung Ki Cho, Hoe Chul Kim, Myung Jun Kim, Jae Jeong Kim
논문명
Voltammetric Observation of Transient Catalytic Behavior of SPS in Copper Electrodeposition?Its Interaction with Cuprous Ion from Comproportionation?
저널명
Journal of The Electrochemical Society
163 8 D428-D433
2016.06
저자
Sunhyung Jurng, Sangjin Park, Taeho Yoon, Hyun-seung Kim, Hyejeong Jeong, Ji Heon Ryu, Jae Jeong Kim, and Seung M. Oh
논문명
Low-Temperature Performance Improvement of Graphite Electrode by Allyl Sulfide Additive and Its Film-Forming Mechanism
저널명
Journal of The Electrochemical Society
163 8 A1798-A1804
2016.04
저자
Sang Won Lee, Ki Ho Bae, Oh Joong Kwon, Jae Jeong Kim
논문명
The effect of TAD based cleaning solution on post Cu CMP process
저널명
Microelectronic Engineering
162 17
2016.03
저자
Tae Jin Lee, Jeong Beom Lee, Taeho Yoon, Daesoo Kim, Oh B. Chae, Jiwon Jung, Jiyong Soon, Ji Heon Ryu, Jae Jeong Kim, and Seung M. Oh
논문명
Tris(pentafluorophenyl)silane as an Electrolyte Additive for 5 V LiNi0.5Mn1.5O4 Positive Electrode
저널명
Journal of The Electrochemical Society
163 6 A898-A903
2016.02
저자
Myung Jun Kim, Youngran Seo, Jung Hwan Oh, Yoonjae Lee, Hoe Chul Kim, Young Gyu Kim, and Jae Jeong Kim
논문명
Communication-Halide Ions in TEG-Based Levelers Affecting TSV Filling Performance
저널명
Journal of The Electrochemical Society
163 5 D185-D187
2016.01
저자
Kwang Hwan Kim, Taeho Lim, Myung Jun Kim, Seunghoe Choe, Seungyeon Baek, and Jae Jeong Kim
논문명
Porous Indium Electrode with Large Surface Area for Effective Electroreduction of N2O
저널명
Electrochemistry Communications
62 13-16
2015.11
저자
Seunghoe Choe, Myung Jun Kim, Kwang Hwan Kim, Hoe Chul Kim, Yongkeun Jeon, Tae Young Kim, Soo-Kil Kim, and Jae Jeong Kim
논문명
High Accuracy Concentration Analysis of Accelerator Components in Acidic Cu Superfilling Bath
저널명
Journal of The Electrochemical Society
163 2 D33-D39
2015.10
저자
Kang Uk Lee, Myung Jun Kim, Kyung Ju Park, Myeongho Kim, and Jae Jeong Kim
논문명
Mobility of Black Pigments for Electrophoretic Display Depending on the Characteristics of Carbon Sphere
저널명
Dyes and Pigments
121 276-281
2015.08
저자
Hoe Chul Kim, Myung Jun Kim, Youngran Seo, Yoonjae Lii, Seunghoe Choe, Young Gyu Kim, Sung Ki Cho, and Jae Jeong Kim
논문명
Bottom-up Filling of TSV-Scaled Trenches by Using Step Current Electrodeposition
저널명
ECS Electrochemistry Letters
4 10 D31-D34
2015.05
저자
Myung Jun Kim, Seunghoe Choe, Hoe Chul Kim, Sung Ki Cho, Soo-Kil Kim, and Jae Jeong Kim
논문명
Electrochemical Behavior of Citric Acid and Its Influence on Cu Electrodeposition for Damascene Metallization
저널명
Journal of The Electrochemical Society
162 8 D354-D359
2015.03
저자
Myung Jun Kim, Youngran Seo, Hoe Chul Kim, Yoonjae Lee, Seunghoe Choe, Young Gyu Kim, Sung Ki Cho, and Jae Jeong Kim
논문명
Galvanostatic Bottom-up Filling of TSV-like Trenches: Choline-based Leveler Containing Two Quaternary Ammoniums
저널명
Electrochimica Acta
163 174-181
2015.02
저자
Seunghoe Choe, Myung Jn Kim, Kwang Hwan Kim, Hoe Chul Kim, Jae Chun Song, Soo-Kil Kim, and Jae Jeong Kim
논문명
Accuracy Improvement in Cyclic Voltammetry Stripping Analysis of Thiourea Concentration in Copper Plating Baths
저널명
Journal of The Electrochemical Society
162 4 H294-H300
2015.01
저자
Kwang Hwan Kim, Taeho Lim, Kyung Ju Park, Hyo-Chol Koo, Myung Jun Kim, and Jae Jeong Kim
논문명
Investigation of Cu Growth Phenomena on Ru Substrate during Electroless Deposition using Hydrazine as a Reducing Agent
저널명
Electrochimica Acta
151 249-255
2014.12
저자
Hoe Chul Kim, Seunghoe Choe, Ji yoon Cho, Donghyung Lee, Il Jung, Won-Seob Cho, Myung Jun Kim, and Jae Jeong Kim
논문명
Bottom-up Filling of through Silicon Vias Using Galvanostatic Cu Electrodeposition with the Modified Organic Additives
저널명
Journal of The Electrochemical Society
162 3 D109-D114
2014.11
저자
Myung Jun Kim, Seunghoe Choe, Hoe Chul Kim, Seung-Joon Lee, Soo-Hyun Kim, Oh Joong Kwon, Jae Jeong Kim
논문명
Cu direct electrodeposition using step current for superfilling on Ru-Al2O3 layer
저널명
Electrochimica Acta
147 371-379
2014.11
저자
Myeongho Kim, Kyung Ju Park, Kang Uk Lee, Myung Jun Kim, Woo-Sik Kim, Oh Joong Kwon, Jae Jeong Kim
논문명
Preparation of black pigment with the Couette?Taylor vortex for electrophoretic displays?
저널명
Chemical Engineering Science
119 245-250
2014.10
저자
Kyung Ju Park, Taeho Lim, Myung Jun Kim, Kwang Hwan Kim, Sun-Mi Hwang, Jae Jeong Kim
논문명
In-situ transmittance measurement for characterization of organic additives in Cu electroless deposition
저널명
Journal of Electroanalytical Chemistry
731 157-162
2014.10
저자
Hoe Chul Kim, Myung Jun Kim, Seunghoe Choe, Taeho Lim, Kyung Ju Park, Kwang Hwan Kim, Sang Hyun Ahn, Soo-Kil Kim, and Jae Jeong Kim
논문명
Electrodeposition of Cu films with low resistivity and improved hardness using additive derivatization
저널명
Journal of The Electrochemical Society
161 14 D749-D755
2014.10
저자
Kwang Hwan Kim, Taeho Lim, Myung Jun Kim, Seunghoe Choe, Kyung Ju Park, Sang Hyun Ahn, Oh Joong Kwon, and Jae Jeong Kim
논문명
Direct Cu Electrodeposition on Electroless Deposited NiWP Barrier Layer on SiO2
저널명
Journal of The Electrochemical Society
161 14 D756-D760

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