Seoul National University
Electronics Processing
Research Laboratary
  • PUBLICATIONS > Paper > 해외저널

해외저널

PUBLICATIONS > Paper > 해외저널 목록
게재일 저자 / 논문명 / 저널명 Vol No. Page
2015.02
저자
Seunghoe Choe, Myung Jn Kim, Kwang Hwan Kim, Hoe Chul Kim, Jae Chun Song, Soo-Kil Kim, and Jae Jeong Kim
논문명
Accuracy Improvement in Cyclic Voltammetry Stripping Analysis of Thiourea Concentration in Copper Plating Baths
저널명
Journal of The Electrochemical Society
162 4 H294-H300
2015.01
저자
Kwang Hwan Kim, Taeho Lim, Kyung Ju Park, Hyo-Chol Koo, Myung Jun Kim, and Jae Jeong Kim
논문명
Investigation of Cu Growth Phenomena on Ru Substrate during Electroless Deposition using Hydrazine as a Reducing Agent
저널명
Electrochimica Acta
151 249-255
2014.12
저자
Hoe Chul Kim, Seunghoe Choe, Ji yoon Cho, Donghyung Lee, Il Jung, Won-Seob Cho, Myung Jun Kim, and Jae Jeong Kim
논문명
Bottom-up Filling of through Silicon Vias Using Galvanostatic Cu Electrodeposition with the Modified Organic Additives
저널명
Journal of The Electrochemical Society
162 3 D109-D114
2014.11
저자
Myung Jun Kim, Seunghoe Choe, Hoe Chul Kim, Seung-Joon Lee, Soo-Hyun Kim, Oh Joong Kwon, Jae Jeong Kim
논문명
Cu direct electrodeposition using step current for superfilling on Ru-Al2O3 layer
저널명
Electrochimica Acta
147 371-379
2014.11
저자
Myeongho Kim, Kyung Ju Park, Kang Uk Lee, Myung Jun Kim, Woo-Sik Kim, Oh Joong Kwon, Jae Jeong Kim
논문명
Preparation of black pigment with the Couette?Taylor vortex for electrophoretic displays?
저널명
Chemical Engineering Science
119 245-250
2014.10
저자
Kyung Ju Park, Taeho Lim, Myung Jun Kim, Kwang Hwan Kim, Sun-Mi Hwang, Jae Jeong Kim
논문명
In-situ transmittance measurement for characterization of organic additives in Cu electroless deposition
저널명
Journal of Electroanalytical Chemistry
731 157-162
2014.10
저자
Hoe Chul Kim, Myung Jun Kim, Seunghoe Choe, Taeho Lim, Kyung Ju Park, Kwang Hwan Kim, Sang Hyun Ahn, Soo-Kil Kim, and Jae Jeong Kim
논문명
Electrodeposition of Cu films with low resistivity and improved hardness using additive derivatization
저널명
Journal of The Electrochemical Society
161 14 D749-D755
2014.10
저자
Kwang Hwan Kim, Taeho Lim, Myung Jun Kim, Seunghoe Choe, Kyung Ju Park, Sang Hyun Ahn, Oh Joong Kwon, and Jae Jeong Kim
논문명
Direct Cu Electrodeposition on Electroless Deposited NiWP Barrier Layer on SiO2
저널명
Journal of The Electrochemical Society
161 14 D756-D760
2014.04
저자
Kang Uk Lee, Myung Jun Kim, Kyung Ju Park, Myeong Ho Kim, Oh Joong Kwon, and Jae Jeong Kim
논문명
Catalytic growth of a colloidal cabon sphere by hydrothermal reaction with iron oxide (Fe3O4) catalyst
저널명
Materials Letters
125 213-217
2014.04
저자
Jae-Min Park, Kwangseon Jin, Byeol Han, Myung Jun Kim, Jongwan Jung, Jae Jeong Kim and Won-Jun Lee
논문명
Atomic layer deposition of copper nitride film and its application to copper seed layer for electrodeposition
저널명
Thin Solid Films
556 434-439
2014.03
저자
Jongwoo Park Insoo Choi Min Jeong Lee Myeong Ho Kim Taeho Lim Kern H. Park Jihyun Jang Seung M. Oh Sung Ki Cho Jae Jeong Kim
논문명
Effect of fluoroethylene carbonate on electrochemical battery performance and the surface chemistry of amorphous MoO2 lithium-ion secondary battery negative electrodes
저널명
Electrochimica Acta
132 338-346
2014.03
저자
Kang Uk Lee, Kyung Ju Park, Myeong Ho Kim, Oh Joong Kwon, Jae Jeong Kim
논문명
Preparation of the carbon sphere coated with iron oxide and its application for electronic paper
저널명
Dyes and Pigments
102 22-28
2014.02
저자
Seunghoe Choe, Myung Jun Kim, Hoe Chul Kim, Taeho Lim, Kyung Ju Park, Kwang Hwan Kim, Sang Hyun Ahn, Anna Lee, Soo-Kil Kim, Jae Jeong Kim
논문명
Degradation of poly(ethylene glycol?propylene glycol) copolymer and its influences on copper electrodeposition?
저널명
Journal of Electroanalytical Chemistry
714-715 85-91
2014.01
저자
Taeho Yoon, Daesoo Kim, Kern H. Park, Hosang Park, Sunhyung Jurng, Jihyun Jang,Ji Heon Ryu, Jae Jeong Kim, and Seung M. Oh
논문명
Compositional Change of Surface Film Deposited on LiNi0.5Mn1.5O4 Positive Electrode
저널명
Journal of The Electrochemical Society
161 4 A519-A523
2014.01
저자
Taeho Lim, Kyung Ju Park, Myung Jun Kim, Hyo-Chol Koo, Kwang Hwan Kim,
논문명
Real-Time Observation of Cu Electroless Deposition:Synergetic Suppression Effect of 2,2′-Dipyridyl and 3-N,N-Dimethylaminodithiocarbamoyl-1-propanesulfonic Acid?
저널명
Journal of The Electrochemical Society
161 4 D135-D140
2014.01
저자
Hoe Chul Kim, Myung Jun Kim, Taeho Lim, Kyung Ju Park, Kwang Hwan Kim, Seunghoe Choe, Soo-Kil Kim, Jae Jeong Kim
논문명
Effects of nitrogen atoms of benzotriazole and its derivatives on the properties of electrodeposited Cu films
저널명
Thin Solid Films
550 421-427
2013.12
저자
Tae Eun Hong, Taehoon Cheon, Soo-Hyun Kim, Jeong-Kyu Kim, Young-Bae Park, Oh Joong Kwon, Myung Jun Kim, Jae Jeong Kim
논문명
Effects of AlOx incorporation into atomic layer deposited Ru thin films: Applications to Cu direct plating technology
저널명
Journal of Alloys and Compounds
580 72-81
2013.11
저자
Kwang Hwan Kim, Taeho Lim, Seunghoe Choe, Insoo Choi, Sang Hyun Ahn, Myung Jun Kim, Kyung Ju Park, Min Hyung Lee, Jae Jeong Kim, and Oh Joong Kwon
논문명
Direct Cu Electrodeposition on Ta Using Pd Nanocolloids: Effect of Allyl Alcohol on the Formation of Seed Layer
저널명
Journal of The Electrochemical Society
160 12 D3206-D3210
2013.11
저자
Myung Jun Kim, Hoe Chul Kim, Seunghoe Choe, Ji Yoon Cho, Donghyung Lee, Il Jung,
논문명
Cu Bottom-Up Filling for Through Silicon Vias with Growing
저널명
Journal of The Electrochemical Society
160 12 D3221-D3227
2013.10
저자
Seunghoe Choe, Myung Jun Kim, Hoe Chul Kim, Sung Ki Cho, Sang Hyun Ahn, Soo-Kil Kim, and Jae Jeong Kim
논문명
Degradation of Bis(3-sulfopropyl) Disulfide and Its Influence on Copper Electrodeposition for Feature Filling
저널명
Journal of The Electrochemical Society
160 12 D3179-D3185

COPYRIGHT © 2008~2016 SNU CBE Mipro, ALL RIGHTS RESERVED.