| 2003. 09. 15 |
| 저자 |
Jae Jeong Kim, Soo-Kil Kim, and Young Shik Kim
|
| 논문명 |
A Novel Method for Cu Electrodeposition on Indium Tin Oxide Aided by Two-Step Sn-Pd activation
|
| 저널명 |
Japanese Journal of Applied Physics
|
|
42 |
Part 2, No. 9A/B |
L1080-L1082 |
| 2003. 08. 01 |
| 저자 |
Jae Jeong Kim, Seung Hwan Cha, and Young-Soo Lee
|
| 논문명 |
Seedless Fill - up of the Damascene Structure Only by Copper Electroless Plating
|
| 저널명 |
Japanese Journal of Applied Physics
|
|
42 |
Part 2, No. 8A |
L953-L955 |
| 2003. 01. 30. |
| 저자 |
Jae Jeong Kim, Soo-Kil Kim, Yong Shik Kim
|
| 논문명 |
catalytic behavior of MPSA(3-mercapto-1-propane sulfonic acid) on Cu electrodeposition and its effect on Cu film properties for CMOS device metallization.
|
| 저널명 |
Journal of Electroanalytical Chemistry
|
|
542 |
|
61-66 |
| 2003. 01. |
| 저자 |
Jae Jeong Kim, Moon Soo Kim, Do Young Yoon
|
| 논문명 |
Effects of an added iodine source (C2H5I) on Ru Metalorganic Chemical Vapor Deposition
|
| 저널명 |
Chemical vapor deposition
|
|
9 |
2 |
105-109 |
| 2002. 12. 16. |
| 저자 |
Jae Jeong Kim, Soo-Kil Kim, Chang Hwa Lee, and Yong Shik Kim
|
| 논문명 |
Investigation of various copper seed layers for copper electrodeposition applicable to ultralarge-scale integration interconnection
|
| 저널명 |
The Journal of Vacuum Science and Technology B
|
|
21 |
1 |
33-38 |
| 2002. 12. 10 |
| 저자 |
Jae Jeong Kim, Yong Shik Kim, and Soo-Kil Kim
|
| 논문명 |
Oxidation Resistive Cu Films by Room Temperature Surface Passivation with Thin Ag Layer
|
| 저널명 |
Electrochemical and Solid-State Letters.
|
|
6 |
2 |
C17-C20 |
| 2002. 11 |
| 저자 |
Jae Jeong Kim,Seung Hwan Cha
|
| 논문명 |
Optimized Surface Treatment of Indium Tin Oxide (ITO) for Copper Electroless Plating
|
| 저널명 |
Japanese Journal of Applied Physics
|
|
41 |
11A |
L1269-L1271 |
| 2002. 08 |
| 저자 |
Jae Jeong Kim, Soo-Kil Kim, and Jong-Uk Bae
|
| 논문명 |
Investigation of Copper Deposition in the Presence of Benzotriazole
|
| 저널명 |
Thin Solid Films
|
|
415 |
|
101-107 |
| 2002. 04 |
| 저자 |
Jae Jeong Kim, Doo Hwan Jung, Moon Soo Kim, Sang Hyun Kim, Do Young Yoon
|
| 논문명 |
Surface Roughness Reducing Effect of Iodine Sources (CH3I, C2H5I) on Ru and RuO2 Composite Films Grown by MOCVD
|
| 저널명 |
Thin Solid Films
|
|
409 |
|
28-32 |
| 2002. 02. |
| 저자 |
Jae Jeong Kim, Jun Yong Kim, Chae Ho Jeong, Nae Hak Park, Sang Bum Han, Jin Won Park, Won-Jun Lee
|
| 논문명 |
Corrosion in Aluminum Chemical Mechanical Planarization for Sub-Quarter Micron Dynamic Random Access Memory Devices
|
| 저널명 |
Japanese Journal of Applied Physics
|
|
41 |
2A (part 1) |
925-929 |
| 2001. 12. |
| 저자 |
Jae Jeong Kim, Seung Hwan Cha
|
| 논문명 |
Optimized Surface Pre-treatments for Cu Electroless Plating in ULSI Device Interconnection
|
| 저널명 |
Japanese Journal of Applied Physics
|
|
40 |
12 |
7151-7155 |
| 2001. 12. |
| 저자 |
Jae Jeong Kim, Soo-Kil Kim
|
| 논문명 |
Optimized Surface Pretreatments for Copper Electroplating
|
| 저널명 |
Applied Surface Science
|
|
183 |
|
311-318 |
| 2001. 11. 15 |
| 저자 |
Jong-Uk Bae, Dong Kyun Sohn, Ji-Soo Park, Chang Hee Han, Jin Won Park, Yeong-Cheol Kim, Jae Jeong Kim
|
| 논문명 |
A Study on Thermal Stability of CoSi2 Employing Novel Fine-Grained Polycrystalline Silicon/CoSi2/Si(001) System
|
| 저널명 |
Japanese Journal of Applied Physics
|
|
40 |
11 |
6307-6310 |
| 1999. 06. |
| 저자 |
Jeong Soo Byun, Byung Hak Lee, Ji-Soo Park, Dong Kyun Sohn, J. Hong, W-J. Cho, Sang Jun Choi, and Jae Jeong Kim
|
| 논문명 |
Reduction of Dichlorosilane-Based Tungsten Silicide Resistivity by Amorphization and Its Applicability as an Electrode
|
| 저널명 |
Journal of the Electrochemical Society
|
|
146 |
6 |
2261-2269 |
| 1999. 02. |
| 저자 |
Jae-Hyun Joo, Jong-Bum Park, Younsoo Kim, Kong-Soo Lee, Jun-Sik Lee, Jae-Sung Roh and Jae-Jeong Kim
|
| 논문명 |
Low Temperature Chemical Vapor Deposition of (Ba, Sr)TiO3 Thin Films for High Density Dynamic Random Access Memory Capacitors
|
| 저널명 |
Japanese Journal of Applied Physics
|
|
38 |
2B |
L195-L198 |
