| 2016.07 |
| 저자 |
Sung Ki Cho, Hoe Chul Kim, Myung Jun Kim, Jae Jeong Kim
|
| 논문명 |
Voltammetric Observation of Transient Catalytic Behavior of SPS in Copper Electrodeposition?Its Interaction with Cuprous Ion from Comproportionation?
|
| 저널명 |
Journal of The Electrochemical Society
|
|
163 |
8 |
D428-D433 |
| 2016.06 |
| 저자 |
Sunhyung Jurng, Sangjin Park, Taeho Yoon, Hyun-seung Kim, Hyejeong Jeong, Ji Heon Ryu, Jae Jeong Kim, and Seung M. Oh
|
| 논문명 |
Low-Temperature Performance Improvement of Graphite Electrode by Allyl Sulfide Additive and Its Film-Forming Mechanism
|
| 저널명 |
Journal of The Electrochemical Society
|
|
163 |
8 |
A1798-A1804 |
| 2016.04 |
| 저자 |
Sang Won Lee, Ki Ho Bae, Oh Joong Kwon, Jae Jeong Kim
|
| 논문명 |
The effect of TAD based cleaning solution on post Cu CMP process
|
| 저널명 |
Microelectronic Engineering
|
|
162 |
|
17 |
| 2016.03 |
| 저자 |
Tae Jin Lee, Jeong Beom Lee, Taeho Yoon, Daesoo Kim, Oh B. Chae, Jiwon Jung, Jiyong Soon, Ji Heon Ryu, Jae Jeong Kim, and Seung M. Oh
|
| 논문명 |
Tris(pentafluorophenyl)silane as an Electrolyte Additive for 5 V LiNi0.5Mn1.5O4 Positive Electrode
|
| 저널명 |
Journal of The Electrochemical Society
|
|
163 |
6 |
A898-A903 |
| 2016.02 |
| 저자 |
Myung Jun Kim, Youngran Seo, Jung Hwan Oh, Yoonjae Lee, Hoe Chul Kim, Young Gyu Kim, and Jae Jeong Kim
|
| 논문명 |
Communication-Halide Ions in TEG-Based Levelers Affecting TSV Filling Performance
|
| 저널명 |
Journal of The Electrochemical Society
|
|
163 |
5 |
D185-D187 |
| 2016.01 |
| 저자 |
Kwang Hwan Kim, Taeho Lim, Myung Jun Kim, Seunghoe Choe, Seungyeon Baek, and Jae Jeong Kim
|
| 논문명 |
Porous Indium Electrode with Large Surface Area for Effective Electroreduction of N2O
|
| 저널명 |
Electrochemistry Communications
|
|
62 |
|
13-16 |
| 2015.11 |
| 저자 |
Seunghoe Choe, Myung Jun Kim, Kwang Hwan Kim, Hoe Chul Kim, Yongkeun Jeon, Tae Young Kim, Soo-Kil Kim, and Jae Jeong Kim
|
| 논문명 |
High Accuracy Concentration Analysis of Accelerator Components in Acidic Cu Superfilling Bath
|
| 저널명 |
Journal of The Electrochemical Society
|
|
163 |
2 |
D33-D39 |
| 2015.10 |
| 저자 |
Kang Uk Lee, Myung Jun Kim, Kyung Ju Park, Myeongho Kim, and Jae Jeong Kim
|
| 논문명 |
Mobility of Black Pigments for Electrophoretic Display Depending on the Characteristics of Carbon Sphere
|
| 저널명 |
Dyes and Pigments
|
|
121 |
|
276-281 |
| 2015.08 |
| 저자 |
Hoe Chul Kim, Myung Jun Kim, Youngran Seo, Yoonjae Lii, Seunghoe Choe, Young Gyu Kim, Sung Ki Cho, and Jae Jeong Kim
|
| 논문명 |
Bottom-up Filling of TSV-Scaled Trenches by Using Step Current Electrodeposition
|
| 저널명 |
ECS Electrochemistry Letters
|
|
4 |
10 |
D31-D34 |
| 2015.05 |
| 저자 |
Myung Jun Kim, Seunghoe Choe, Hoe Chul Kim, Sung Ki Cho, Soo-Kil Kim, and Jae Jeong Kim
|
| 논문명 |
Electrochemical Behavior of Citric Acid and Its Influence on Cu Electrodeposition for Damascene Metallization
|
| 저널명 |
Journal of The Electrochemical Society
|
|
162 |
8 |
D354-D359 |
| 2015.03 |
| 저자 |
Myung Jun Kim, Youngran Seo, Hoe Chul Kim, Yoonjae Lee, Seunghoe Choe, Young Gyu Kim, Sung Ki Cho, and Jae Jeong Kim
|
| 논문명 |
Galvanostatic Bottom-up Filling of TSV-like Trenches: Choline-based Leveler Containing Two Quaternary Ammoniums
|
| 저널명 |
Electrochimica Acta
|
|
163 |
|
174-181 |
| 2015.02 |
| 저자 |
Seunghoe Choe, Myung Jn Kim, Kwang Hwan Kim, Hoe Chul Kim, Jae Chun Song, Soo-Kil Kim, and Jae Jeong Kim
|
| 논문명 |
Accuracy Improvement in Cyclic Voltammetry Stripping Analysis of Thiourea Concentration in Copper Plating Baths
|
| 저널명 |
Journal of The Electrochemical Society
|
|
162 |
4 |
H294-H300 |
| 2015.01 |
| 저자 |
Kwang Hwan Kim, Taeho Lim, Kyung Ju Park, Hyo-Chol Koo, Myung Jun Kim, and Jae Jeong Kim
|
| 논문명 |
Investigation of Cu Growth Phenomena on Ru Substrate during Electroless Deposition using Hydrazine as a Reducing Agent
|
| 저널명 |
Electrochimica Acta
|
|
151 |
|
249-255 |
| 2014.12 |
| 저자 |
Hoe Chul Kim, Seunghoe Choe, Ji yoon Cho, Donghyung Lee, Il Jung, Won-Seob Cho, Myung Jun Kim, and Jae Jeong Kim
|
| 논문명 |
Bottom-up Filling of through Silicon Vias Using Galvanostatic Cu Electrodeposition with the Modified Organic Additives
|
| 저널명 |
Journal of The Electrochemical Society
|
|
162 |
3 |
D109-D114 |
| 2014.11 |
| 저자 |
Myung Jun Kim, Seunghoe Choe, Hoe Chul Kim, Seung-Joon Lee, Soo-Hyun Kim, Oh Joong Kwon, Jae Jeong Kim
|
| 논문명 |
Cu direct electrodeposition using step current for superfilling on Ru-Al2O3 layer
|
| 저널명 |
Electrochimica Acta
|
|
147 |
|
371-379 |
| 2014.11 |
| 저자 |
Myeongho Kim, Kyung Ju Park, Kang Uk Lee, Myung Jun Kim, Woo-Sik Kim, Oh Joong Kwon, Jae Jeong Kim
|
| 논문명 |
Preparation of black pigment with the Couette?Taylor vortex for electrophoretic displays?
|
| 저널명 |
Chemical Engineering Science
|
|
119 |
|
245-250 |
| 2014.10 |
| 저자 |
Kyung Ju Park, Taeho Lim, Myung Jun Kim, Kwang Hwan Kim, Sun-Mi Hwang, Jae Jeong Kim
|
| 논문명 |
In-situ transmittance measurement for characterization of organic additives in Cu electroless deposition
|
| 저널명 |
Journal of Electroanalytical Chemistry
|
|
731 |
|
157-162 |
| 2014.10 |
| 저자 |
Hoe Chul Kim, Myung Jun Kim, Seunghoe Choe, Taeho Lim, Kyung Ju Park, Kwang Hwan Kim, Sang Hyun Ahn, Soo-Kil Kim, and Jae Jeong Kim
|
| 논문명 |
Electrodeposition of Cu films with low resistivity and improved hardness using additive derivatization
|
| 저널명 |
Journal of The Electrochemical Society
|
|
161 |
14 |
D749-D755 |
| 2014.10 |
| 저자 |
Kwang Hwan Kim, Taeho Lim, Myung Jun Kim, Seunghoe Choe, Kyung Ju Park, Sang Hyun Ahn, Oh Joong Kwon, and Jae Jeong Kim
|
| 논문명 |
Direct Cu Electrodeposition on Electroless Deposited NiWP Barrier Layer on SiO2
|
| 저널명 |
Journal of The Electrochemical Society
|
|
161 |
14 |
D756-D760 |
| 2014.04 |
| 저자 |
Kang Uk Lee, Myung Jun Kim, Kyung Ju Park, Myeong Ho Kim, Oh Joong Kwon, and Jae Jeong Kim
|
| 논문명 |
Catalytic growth of a colloidal cabon sphere by hydrothermal reaction with iron oxide (Fe3O4) catalyst
|
| 저널명 |
Materials Letters
|
|
125 |
|
213-217 |
