| 2014.02 |
| 저자 |
Seunghoe Choe, Myung Jun Kim, Hoe Chul Kim, Taeho Lim, Kyung Ju Park, Kwang Hwan Kim, Sang Hyun Ahn, Anna Lee, Soo-Kil Kim, Jae Jeong Kim
|
| 논문명 |
Degradation of poly(ethylene glycol?propylene glycol) copolymer and its influences on copper electrodeposition?
|
| 저널명 |
Journal of Electroanalytical Chemistry
|
|
714-715 |
|
85-91 |
| 2014.01 |
| 저자 |
Taeho Yoon, Daesoo Kim, Kern H. Park, Hosang Park, Sunhyung Jurng, Jihyun Jang,Ji Heon Ryu, Jae Jeong Kim, and Seung M. Oh
|
| 논문명 |
Compositional Change of Surface Film Deposited on LiNi0.5Mn1.5O4 Positive Electrode
|
| 저널명 |
Journal of The Electrochemical Society
|
|
161 |
4 |
A519-A523 |
| 2014.01 |
| 저자 |
Taeho Lim, Kyung Ju Park, Myung Jun Kim, Hyo-Chol Koo, Kwang Hwan Kim,
|
| 논문명 |
Real-Time Observation of Cu Electroless Deposition:Synergetic Suppression Effect of 2,2′-Dipyridyl and 3-N,N-Dimethylaminodithiocarbamoyl-1-propanesulfonic Acid?
|
| 저널명 |
Journal of The Electrochemical Society
|
|
161 |
4 |
D135-D140 |
| 2014.01 |
| 저자 |
Hoe Chul Kim, Myung Jun Kim, Taeho Lim, Kyung Ju Park, Kwang Hwan Kim, Seunghoe Choe, Soo-Kil Kim, Jae Jeong Kim
|
| 논문명 |
Effects of nitrogen atoms of benzotriazole and its derivatives on the properties of electrodeposited Cu films
|
| 저널명 |
Thin Solid Films
|
|
550 |
|
421-427 |
| 2013.12 |
| 저자 |
Tae Eun Hong, Taehoon Cheon, Soo-Hyun Kim, Jeong-Kyu Kim, Young-Bae Park, Oh Joong Kwon, Myung Jun Kim, Jae Jeong Kim
|
| 논문명 |
Effects of AlOx incorporation into atomic layer deposited Ru thin films: Applications to Cu direct plating technology
|
| 저널명 |
Journal of Alloys and Compounds
|
|
580 |
|
72-81 |
| 2013.11 |
| 저자 |
Kwang Hwan Kim, Taeho Lim, Seunghoe Choe, Insoo Choi, Sang Hyun Ahn, Myung Jun Kim, Kyung Ju Park, Min Hyung Lee, Jae Jeong Kim, and Oh Joong Kwon
|
| 논문명 |
Direct Cu Electrodeposition on Ta Using Pd Nanocolloids: Effect of Allyl Alcohol on the Formation of Seed Layer
|
| 저널명 |
Journal of The Electrochemical Society
|
|
160 |
12 |
D3206-D3210 |
| 2013.11 |
| 저자 |
Myung Jun Kim, Hoe Chul Kim, Seunghoe Choe, Ji Yoon Cho, Donghyung Lee, Il Jung,
|
| 논문명 |
Cu Bottom-Up Filling for Through Silicon Vias with Growing
|
| 저널명 |
Journal of The Electrochemical Society
|
|
160 |
12 |
D3221-D3227 |
| 2013.10 |
| 저자 |
Seunghoe Choe, Myung Jun Kim, Hoe Chul Kim, Sung Ki Cho, Sang Hyun Ahn, Soo-Kil Kim, and Jae Jeong Kim
|
| 논문명 |
Degradation of Bis(3-sulfopropyl) Disulfide and Its Influence on Copper Electrodeposition for Feature Filling
|
| 저널명 |
Journal of The Electrochemical Society
|
|
160 |
12 |
D3179-D3185 |
| 2013.09 |
| 저자 |
Kyung Ju Park, Kang Uk Lee, Myeong Ho Kim, Oh Joong Kwon, Jae Jeong Kim
|
| 논문명 |
Preparation of PS/TiO2 as a white pigment for electrophoretic displays
|
| 저널명 |
Current Applied Physics
|
|
13 |
|
1231-1236 |
| 2013.09 |
| 저자 |
Taeho Lim, Kyung Ju Park, Myung Jun Kim, Hyo-Chol Koo, Kwang Hwan Kim, Seunghoe Choe, and Jae Jeong Kim
|
| 논문명 |
Real-Time Observation of Cu Electroless Deposition: Effect of EDTA on Removing of Cu Oxide and Adsorptionof Formaldehyde
|
| 저널명 |
Journal of The Electrochemical Society
|
|
160 |
12 |
D3134-D3138 |
| 2013.08 |
| 저자 |
Myung Jun Kim, Taeho Lim, Kyung Ju Park, Soo-Kil Kim, and Jae Jeong Kim
|
| 논문명 |
Pulse-Reverse Electrodeposition of Cu for the Fabrication of Metal Interconnection I. Effects of Anodic Steps on the Competitive Adsorption of the Additives Used for Superfilling
|
| 저널명 |
Journal of The Electrochemical Society
|
|
160 |
12 |
D3081-D3087 |
| 2013.08 |
| 저자 |
Myung Jun Kim, Taeho Lim, Kyung Ju Park, Soo-Kil Kim, and Jae Jeong Kim
|
| 논문명 |
Pulse-Reverse Electrodeposition of Cu for the Fabrication of Metal Interconnection II. Enhancement of Cu Superfilling and Leveling
|
| 저널명 |
Journal of The Electrochemical Society
|
|
160 |
12 |
D3088-D3092 |
| 2013.08 |
| 저자 |
Myung Jun Kim, Kyung Ju Park, Taeho Lim, Oh Joong Kwon, and Jae Jeong Kim
|
| 논문명 |
Fabrication of Cu-Ag Interconnection Using Electrodeposition: The Mechanism of Superfilling and the Properties of Cu-Ag Film
|
| 저널명 |
Journal of The Electrochemical Society
|
|
160 |
12 |
D3126-D3133 |
| 2013.07 |
| 저자 |
Myung Jun Kim, Hoe Chul Kim, Soo-Hyun Kim, Seungmin Yeo, Oh Joong Kwon, and Jae Jeong Kim
|
| 논문명 |
Direct Electrodeposition of Cu on Ru-Al2O3 Layer
|
| 저널명 |
Journal of The Electrochemical Society
|
|
160 |
12 |
D3057-D3062 |
| 2013.07 |
| 저자 |
Hosang Park, Taeho Yoon, Junyoung Mun, Ji Heon Ryu, Jae Jeong Kim, and Seung M. Oh
|
| 논문명 |
A Comparative Study on Thermal Stability of Two Solid Electrolyte Interphase (SEI) Films on Graphite Negative Electrode
|
| 저널명 |
Journal of The Electrochemical Society
|
|
160 |
9 |
A1539-A1543 |
| 2013.07 |
| 저자 |
Kun Woo Kim, Hosang Park, Jae Gil Lee, Jongjung Kim, Young-Ugk Kim, Ji Heon Ryu, Jae Jeong Kim, Seung M. Oh
|
| 논문명 |
Capacity Variation of Carbon-coated Silicon Monoxide Negative Electrode for Lithium-ion Batteries
|
| 저널명 |
Electrochimica Acta
|
|
103 |
|
226-230 |
| 2013.05.07 |
| 저자 |
Tae Eun Hong, Taehoon Cheon, Soo-Hyun Kim, Jeong-Kyu Kim, Young-Bae Park, Oh Joong Kwon, Myung Jun Kim, Jae Jeong Kim
|
| 논문명 |
Effects of AlOx incorporation into atomic layer deposited Ru thin films: Applications to Cu direct plating technology
|
| 저널명 |
Journal of Alloys and Compounds
|
|
280 |
|
72-81 |
| 2013.03.26 |
| 저자 |
Taeho Lim, Kyung Ju Park, Myung Jun Kim, Hyo-Chol Koo, Kwang Hwan Kim, Seunghoe Choe, Young-Soo Lee and Jae Jeong Kim
|
| 논문명 |
Real-Time Observation of Cu Electroless Deposition: Adsorption Behavior of PEG during Cu Electroless Deposition
|
| 저널명 |
Journal of The Electrochemical Society
|
|
160 |
12 |
D3015-D3020 |
| 2013.03.19 |
| 저자 |
Kyung Ju Park, Kang Uk Lee, Myeong Ho Kim, Oh Joong Kwon, Jae Jeong Kim
|
| 논문명 |
Preparation of PS/TiO2 as a white pigment for electrophoretic displays
|
| 저널명 |
Current Applied Physics
|
|
|
|
|
| 2013.02.18 |
| 저자 |
Seunghoe Choe, Myung Jun Kim, Hoe Chul Kim, Taeho Lim, Kyung Ju Park, Sung Ki Cho, Soo-Kil Kim, Jae Jeong Kim
|
| 논문명 |
Seed Repair by Electrodeposition in Pyrophosphate Solution for Acid Cu Superfilling
|
| 저널명 |
Journal of The Electrochemical Society
|
|
160 |
4 |
D202-D250 |
