| 2010.12.22 |
| 저자 |
Yung Jun Kim, Oh Joong Kwon, Min Cheol Kang, Jae Jeong Kim
|
| 논문명 |
Effects of the Functional Groups of Complexing Agents and Cu Oxide Formation on Cu Dissolution Behaviors in Cu CMP Process
|
| 저널명 |
Journal of the Electrochemical Society
|
|
158 |
2 |
H190-H196 |
| 2010.09.08 |
| 저자 |
Sang Hyun Ahn, Oh Joong Kwon, Soo-Kil Kim, Insoo Choi, Jae Jeong Kim
|
| 논문명 |
Electrochemical preparation of Pt-based ternary alloy catalyst for direct methanol fuel cell anode
|
| 저널명 |
International Journal of Hydrogen Energy
|
|
35 |
|
13309-13316 |
| 2010.09.07 |
| 저자 |
Myung Jun Kim, Sung Ki Cho, Hyo-Chol Koo, Taeho Lim, Kyung Ju Park, Jae Jeong Kim
|
| 논문명 |
Pulse Electrodeposition for Improving Electrical Properties of Cu Thin Film
|
| 저널명 |
Journal of The Electrochemical Society
|
|
157 |
11 |
D564-D569 |
| 2010.08.17 |
| 저자 |
Yung Jun Kim, Oh Joong Kwon, Min Cheol Kang, Myung-Won Suh, Young Im, Jae Jeong Kim
|
| 논문명 |
Development of a Copper Chemical Mechanical polishing Slurry at Neutral pH Based on Ceria Slurry
|
| 저널명 |
Journal of The Electrochemical Society
|
|
157 |
10 |
H952-H958 |
| 2010.08.03 |
| 저자 |
Sun-Mi Hwang, Chang Hwa Lee, Jae Jeong Kim, Thomas P. Moffat
|
| 논문명 |
Oxygen reduction reaction on electrodeposited Pt100?x?yNixPdy thin films?
|
| 저널명 |
Electrochimica Acta
|
|
55 |
28 |
8938?8946? |
| 2009.11.13 |
| 저자 |
Sung Ki Cho, Taeho Lim, Hong-Kee Lee, Jae Jeong Kim
|
| 논문명 |
A Study on Seed Damage in Plating Electrolyte and Its Repairing in Cu Damascene Metallization
|
| 저널명 |
Journal of The Electrochemical Society
|
|
157 |
4 |
D187-192 |
| 2009.10.01 |
| 저자 |
Min Cheol Kang, Yung Jun Kim, Hyo-Chol Koo, Sung Ki Cho, Jae Jeong Kim
|
| 논문명 |
Local Corrosion of the Oxide Passivation Layer during Cu Chemical Mechanical Polishing
|
| 저널명 |
Electrochemical and Solid-State Letters
|
|
12 |
12 |
H433-H436 |
| 2009.07.31 |
| 저자 |
Jung Woo Ko, Hyo Chol Koo, Dong Wan Kim, Sung Min Seo, Tae June Kang, Yongjoo Kwon, Jung Lim Yoon, Jun Ho Cheon, Yong Hyup Kim, Jae Jeong Kim, Young June Park
|
| 논문명 |
Electroless Gold Plating on Aluminum Patterned Chips for CMOS-based Sensor Applications
|
| 저널명 |
Journal of The Electrochemical Society
|
|
157 |
1 |
D46-D49 |
| 2009. 07. 22 |
| 저자 |
Sang Hyun Ahn, Oh Joong Kwon, Insoo Choi, Jae Jeong Kim
|
| 논문명 |
Synergetic effect of combined use of Cu?ZnO?Al2O3 and Pt?Al2O3 for the steam reforming of methanol?
|
| 저널명 |
Catalysis Communications
|
|
10 |
|
2018-2022 |
| 2009. 07. 01 |
| 저자 |
Min Cheol Kang, Yung Jun Kim, and Jae Jeong Kim
|
| 논문명 |
In Situ Formation of Ag Capping Layer for Preventing Oxidation in Copper Chemical Mechanical Polishing
|
| 저널명 |
Electrochemical and Solid state Letters
|
|
12 |
9 |
H340-H343 |
| 2009. 05. 29 |
| 저자 |
Jaehui Ahn, Hong-Yeol Kim, Hyo-chol Koo, Jae Jeong Kim, Jihyun Kim
|
| 논문명 |
Characterization and Cu Electroless Plating of Laser-drilled Through-Wafer via-holes in GaN/Al2O3
|
| 저널명 |
Thin Solid Films
|
|
517 |
14 |
3841?3843? |
| 2009. 05. 12 |
| 저자 |
Hyo-Chol Koo, Sung Ki Cho, Oh Joong Kwon, Myung-Won Suh, Young Im, and Jae Jeong Kim
|
| 논문명 |
Improvement in the Oxidation Resistance of Cu Films by an Electroless Co-Alloy Capping Process
|
| 저널명 |
Journal of The Electrochemical Society
|
|
156 |
7 |
D236-D241 |
| 2009. 04. 21 |
| 저자 |
Chang Hwa Lee, Ae Rim Kim, Hyo-Chol Koo and Jae Jeong Kim
|
| 논문명 |
Effect of 2-Mercapto-5-benzimidazolesulfonic Acid in Superconformal Cu Electroless Deposition
|
| 저널명 |
Journal of The Electrochemical Society
|
|
156 |
6 |
D207-D210 |
| 2009. 01. 15 |
| 저자 |
Sun-Mi Hwang, Oh Joong Kwon, Sang Hyun Ahn and Jae Jeong Kim
|
| 논문명 |
Silicon-based micro-reactor for preferential CO oxidation
|
| 저널명 |
Chemical Engineering Journal
|
|
146 |
|
105-111 |
| 2008. 07. 15 |
| 저자 |
Jeong Gil Seo, Min Hye Youn, Ho-In Lee, Jae Jeong Kim, Eunsun Yang, Jin Suk Chung, Pil Kim and In Kyu Song
|
| 논문명 |
Hydrogen production by steam reforming of liquefied natural gas (LNG) over mesoporous nickel-alumina xerogel catalysts: Effect of nickel content
|
| 저널명 |
Chemical Engineering Journal
|
|
141 |
|
298-304 |
| 2008. 07. 08 |
| 저자 |
Hyo-Chol Koo, Seo Young Kim, Sung Ki Cho and Jae Jeong Kim
|
| 논문명 |
Ag Seed-Layer Formation by Electroless Plating for Ultra-Large-Scale Integration Interconnection
|
| 저널명 |
Journal of The Electrochemical Society
|
|
155 |
9 |
D558-D562 |
| 2008. 07. 01 |
| 저자 |
Oh Joong Kwon, Duk Hyoung Yoon and Jae Jeong Kim
|
| 논문명 |
Silicon-based miniaturized reformer with methanol catalytic burner
|
| 저널명 |
Chemical Engineering Journal
|
|
140 |
|
466-472 |
| 2008. 04. 30 |
| 저자 |
Moo Seong Kang, Soo-Kil Kim, Keeho Kim, and Jae Jeong Kim
|
| 논문명 |
The influence of thiourea on copper electrodeposition: adsorbate identification and effect on electrochemical nucleation
|
| 저널명 |
Thin Solid Films
|
|
516 |
|
3761-3766 |
| 2008. 03. 20 |
| 저자 |
Hyo-Chol Koo, Sung Ki Cho, Chang Hwa Lee, Soo-Kil Kim, Oh Joong Kwon and Jae Jeong Kim
|
| 논문명 |
Silver Direct Electrodeposition on Ru Thin Film
|
| 저널명 |
Journal of The Electrochemical Society
|
|
155 |
5 |
D389-D394 |
| 2008. 01. 02 |
| 저자 |
Hyo-Chol Koo and Jae Jeong Kim
|
| 논문명 |
Effects of Stabilizing Agents on Film Properties in Ag Electroless Plating
|
| 저널명 |
Journal of The Electrochemical Society
|
|
155 |
3 |
D176-D180 |
