| 2005. 12. 06 |
| 저자 |
Soo-Kil Kim, Soonsik Hwang, Sung Ki Cho, and Jae Jeong Kim
|
| 논문명 |
Leveling of Superfilled Damascene Cu Film Using Two-Step Electrodeposition
|
| 저널명 |
Electrochemical and Solid-State Letters.
|
|
9 |
2 |
C25-C28 |
| 2005. 11. 09. |
| 저자 |
Moo Sung Kang, Soo-Kil Kim, Jae Jeong Kim
|
| 논문명 |
A Novel Process to Control the Surface Roughness and Resistivity of Electroplated Cu Using Thiourea
|
| 저널명 |
Japanese Journal of Applied Physics
|
|
44 |
11 |
8107-8109 |
| 2005. 10. 24. |
| 저자 |
Jong Won Lee, Min Cheol Kang, Jae Jeong Kim
|
| 논문명 |
Charaterization of 5-aminotetrazole (ATRA) as a corrosion inhibitor in copper chemical mechanical polishing
|
| 저널명 |
Journal of The Electrochemical Society
|
|
152 |
12 |
C827-C831 |
| 2005. 09. 22. |
| 저자 |
Chang Hwa Lee, Sung Ki Cho and Jae Jeong Kim
|
| 논문명 |
Electroless Cu bottom-up filling using 3-N,N-Dimethylaminodithiocarbanmoyl-1-propanesulfonic acid (DPS)
|
| 저널명 |
Electrochemical and Solid-State Letters.
|
|
8 |
11 |
J27-J29 |
| 2005. 09. 16. |
| 저자 |
Seung Hwan Cha, Seung-Soo Kim, Sung Ki Cho and Jae Jeong Kim
|
| 논문명 |
Bottom up Filling Using Electrical Oxidation on Pattern Wafer
|
| 저널명 |
Electrochemical and Solid-State Letters.
|
|
8 |
11 |
C170-C172 |
| 2005. 08. 05 |
| 저자 |
Min Cheol Kang, Jae Jeong Kim and Doo-Kyung Moon
|
| 논문명 |
Effect of Organic Additives on Ceria Slurry in Shallow Trench Isolation Chemical Mechanical Planarization
|
| 저널명 |
Japanese Journal of Applied Physics
|
|
44 |
8 |
5949-5952 |
| 2005. 06. 07. |
| 저자 |
Chang Hwa Lee, Sang Chul Lee, Jae Jeong Kim
|
| 논문명 |
Improvement of electrolessly gap-filled Cu using 2,2'-dipyridyl and bis-(3-sulfopropyl)-disulfide (SPS)
|
| 저널명 |
Electrochemical and Solid-State Letters.
|
|
8 |
8 |
C110-C113 |
| 2005. 05. 30 |
| 저자 |
Chang Hwa Lee, Sang Chul Lee and Jae Jeong Kim
|
| 논문명 |
Bottom-up filling in Cu electroless deposition using bis-(3-sulfopropyl)-disulfide (SPS)
|
| 저널명 |
Electrochimica Acta
|
|
50 |
|
3563-3568 |
| 2005. 05. 05. |
| 저자 |
Seung Hwan Cha , Hyo-Chol Koo and Jae Jeong Kim
|
| 논문명 |
The Inhibition of Silver Agglomeration by Gold Activation in Silver Electroless Plating
|
| 저널명 |
Journal of The Electrochemical Society
|
|
152 |
6 |
C388-C391 |
| 2005. 04. 07 |
| 저자 |
Sung Ki Cho, Soo-Kil Kim, Jae Jeong Kim
|
| 논문명 |
Superconformal Cu electrodeposition using DPS; A substitutive accelerator for SPS
|
| 저널명 |
Journal of The Electrochemical Society
|
|
152 |
5 |
C330-C333 |
| 2005. 03. 11. |
| 저자 |
Chang Hwa Lee and Jae Jeong Kim
|
| 논문명 |
Effects of Pd activation on the self annealing of electroless copper deposition using Co(II)-ethylenediamine as a reducing agent
|
| 저널명 |
The Journal of Vacuum Science and Technology B
|
|
23 |
2 |
475~479 |
| 2004. 11. 29. |
| 저자 |
Soo-Kil Kim, Sung Ki Cho, Jae Jeong Kim, and Young-Soo Lee
|
| 논문명 |
Superconformal Cu Electrodeposition on Various Substrates
|
| 저널명 |
Electrochemical and Solid-State Letters.
|
|
8 |
1 |
C19~C21 |
| 2004. 11. 04. |
| 저자 |
Sung Ki Cho, Soo-Kil Kim, Hee Han, Jae Jeong Kim, and Seung Mo Oh
|
| 논문명 |
Damascene Cu electrodeposition on metal organic chemical vapor deposition-grown Ru film barrier
|
| 저널명 |
The Journal of Vacuum Science and Technology B
|
|
22 |
6 |
2649~2653 |
| 2004. 09. 07 |
| 저자 |
Eung Jin Ahn and Jae Jeong Kim
|
| 논문명 |
Additives for Super-conformal Electroplating of Ag Thin Film for ULSI
|
| 저널명 |
Electrochemical and Solid-State Letters.
|
|
7 |
10 |
C118~C120 |
| 2004. 08. 04. |
| 저자 |
Soo-Kil Kim and Jae Jeong Kim
|
| 논문명 |
Additive-free Superfilling in Damascene Cu Electrodeposition using Microcontact Printing
|
| 저널명 |
Electrochemical and Solid-State Letters.
|
|
7 |
9 |
C101~C103 |
| 2004. 08. 04. |
| 저자 |
Soo-Kil Kim and Jae Jeong Kim
|
| 논문명 |
Superfilling Evolution in Cu Electrodeposition; Dependence on the Aging Time of the Accelerator
|
| 저널명 |
Electrochemical and Solid-State Letters.
|
|
7 |
9 |
C98~C100 |
| 2004. 05. 24. |
| 저자 |
Hee Han, Jae Jeong Kim and Do Young Yoon
|
| 논문명 |
Pretreatment technique for surface improvement of Ru films in Ru-metalorganic chemical vapor deposition
|
| 저널명 |
The Journal of Vacuum Science and Technology A
|
|
22 |
4 |
1120-1123 |
| 2004. 01. 20. |
| 저자 |
Chang Hwa Lee and Jae Jeong Kim
|
| 논문명 |
Self-annealing effect of electrolessly deposited copper thin films based on Co(II)-ethylenediamine as a reducing agent
|
| 저널명 |
The Journal of Vacuum Science and Technology B
|
|
22 |
1 |
180~184 |
| 2004. 01. 09. |
| 저자 |
Oh Joong Kwon, Seung Hwan Cha, and Jae Jeong Kim
|
| 논문명 |
Ruthenium Bottom Electrode Prepared by Electroplating for a High-density DRAM Capacitor
|
| 저널명 |
Journal of the Electrochemical Society
|
|
151 |
2 |
C127-C132 |
| 2003. 12. 09. |
| 저자 |
Jae Jeong Kim, Soo-Kil Kim, and Yong Shik Kim
|
| 논문명 |
Direct Plating of Low Resistivity Bright Cu Films onto TiN Barrier Layer via Pd Activation
|
| 저널명 |
Journal of the Electrochemical Society
|
|
151 |
1 |
C97~C101 |
