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국제학술대회

PUBLICATIONS > Presentation > 국제학술대회 목록
게재일 발표자 / 제목 / 학회명
2018.05.17
발표자
Y. Ham, M. J. Kim, T. Lim, S. K. Kim, J. J. Kim
제목
Electrodeposition of Ag Catalyst for Electrochemical CO2 Reduction
학회명
233rd ECS meeting
2018.05.15
발표자
Y. Jeon, M. J. Kim, S. Choe, H. C. Kim, J. J. Kim
제목
Fabrication of Cu-Ag Film by Electrodeposition in Ammonia-based Electrolyte
학회명
233rd ECS meeting
2018.05.15
발표자
S. Baek, H. Kim, K. H. Kim, O. S. Kwon, O. J. Kwon, J. J. Kim
제목
Electrochemical reduction of greenhouse gas with Couette-Taylor vortex reaction
학회명
233rd ECS meeting
2018.05.14
발표자
B. K. KIm, S. K. Kim, S. K. Cho, J. J. Kim
제목
Effect of Alloying on Electrodeposited Ni Electrocatalyst for Oxygen Evolution Reaction
학회명
233rd ECS meeting
2017.10.04
발표자
M. J. Kim, P. F. Flowers, I. E. Stewart, S. Ye (Duke University), S. Baek, J. J. Kim (Seoul National University), and B. J. Wiley (Duke University)
제목
A Single-Crystal Electrochemical Study of the Facet-Selective Chemistry That Drives Anisotropic Growth of Cu Nanowires
학회명
232th ECS meeting
2017.08.30
발표자
Tae Young Kim, Seoung Hoe Choe, Hoe Chul Kim, Yu Seok Ham and Jae Jeoung Kim
제목
“Effect of Electrolyte Acidity on the SPS Decomposition in Cu Electrodeposition?
학회명
ISE Annual Meeting 2017
2017.08.30
발표자
Minjae Sung, Yu Seok Ham, Young Yoon, TaeHo Lim, and Jae Jeong Kim
제목
Grain size-controlled filling of Through silicon via
학회명
ISE Annual Meeting 2017
2017.08.30
발표자
Myung Hyun Lee, Yu Seok Ham, Sung Ki Cho, and Jae Jeong Kim
제목
The influence of the synergistic inhibition between suppressor and halide ion for void-free filling in micro via filling
학회명
ISE Annual Meeting 2017
2017.08.30
발표자
Jin Uk Byun, Sang Hyun Ahn, and Jae Jeong Kim
제목
Self-terminating electrodeposition of atomic scale platinum film on titanium nitride as an electrochemical catalyst
학회명
ISE Annual Meeting 2017
2016.10.05
발표자
S. Baek, M. J. Kim, K. H. Kim, and J. J. Kim
제목
One-Step Fabrication of Whisker Catalyst By Galvanic Displacement Reaction and Its Application As the Electrocatalyst
학회명
PRiME 2016
2016.10.05
발표자
M. Kim, I. Choi, M. J. Kim, and J. J. Kim
제목
The Structure Modification of Substrate for Alloying Materials in Li-Ion Secondary Battery
학회명
PRiME 2016
2016.04.18
발표자
Yu Seok Ham, Seunghoe Choe, Myung Jun Kim, Hoe Chul Kim, Soo-Kil Kim, Jae Jeong Kim
제목
Fabrication of porous Au-Ag bimetallic electrocatalyst synthesized via electrodeposition for CO2 reduction
학회명
19th Topical Meeting of the International Socitety of Electrochemistry
2016.04.18
발표자
Hoe Chul Kim, Seunghoe Choe, Myung Jun Kim, Young Gyu Kim, Jae Jeong Kim, Yoonjae Lee, Youngran Seo
제목
Bottom-up Filling of Through Silicon Vias Based on Electrochemically Derived Filling Mechanism with Ammonium-Containing levelers
학회명
19th Topical Meeting of the International Socitety of Electrochemistry
2014.10.07
발표자
Myeongho Kim, Kyung Ju Park, Kang Uk Lee, Myung Jun Kim, Oh Joong Kwon, and Jae Jeong Kim
제목
Black Pigment Preparation VIa Couette-Taylor Vortex for Electrophoretic Display Application
학회명
226th ECS meeting
2014.10.07
발표자
Seunghoe Choe, Myung Jun Kim, Kwang Hwan Kim, Heo Chul Kim, Anna Lee, Soo-Kil Kim, and Jae Jeong Kim
제목
Degradation of Organic Additives and Its Influences on Cu Electrodepostion
학회명
226th ECS meeting
2014.10.07
발표자
Jae Jeong Kim, Myung Jun Kim, Seunghoe Choe, Kwang Hwan Kim, Heo Chul Kim, and Anna Lee
제목
Recent Progress in Cu Electrodeposition for TSV(Through Silicon Via)
학회명
226th ECS meeting
2014.10.07
발표자
Youngkwang Kim, Kanghoon Kim, Insoo Choi, Jae Jeong Kim, and Oh Joon Kwon
제목
The Application of Ultrasound to the Coating of Platinum Catalyst on Membrane for Proton Exchange Membrane Fule Cell
학회명
226th ECS meeting
2014.10.07
발표자
Hyung Joon Lee, Kanghoon Kim, Jae Jeong Kim, and Oh Joong Kwon
제목
Sonochemical Synthesis of Platinum Catalysts Supported on Carbonized
학회명
226th ECS meeting
2014.07.01
발표자
함유석, 김명준, 최지희, 김수길, 김재정?
제목
Fabrication of Au Catalyst for electrochemical reduction of CO2 to syngas
학회명
Nano Korea 2015
2014.05.13
발표자
Hoe Chul Kim, Myung Jun Kim, Seunghoe Choe, Ji Yoon Cho, Donghyung Lee, Il Jung, Won-Seob Cho, and Jae Jeong Kim
제목
Bottom-up through Silicon Via Filling Using Galvanostatic Cu Electrodeposition with Three-Additive Chemistry
학회명
225th ECS Meeting

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