| 2003. 05. 23 |
| 발표자 |
Hyo-Chol Koo, Seung Hwan Cha, Jae Jeong Kim
|
| 제목 |
Investigation of surface pretreatments for silver electroless deposition
|
| 학회명 |
Korea-Japan Symposium on Materials
|
|
| 2003. 05. 02 |
| 발표자 |
Seung Hwan Cha, Hyo-Chol Koo, Oh Joong Kwon, Jae Jeong Kim
|
| 제목 |
Silver Electroless Plating on Substrate Activated by Gold for Interconnection in Microelectronic Devices
|
| 학회명 |
203rd Meeting of ECS
|
|
| 2003. 05. 02 |
| 발표자 |
Soo-Kil Kim, Yong Shik Kim, and Jae Jeong Kim
|
| 제목 |
Cu Electroplating on High resistivity TiN Barrier by Aid of Pd Activation
|
| 학회명 |
203rd Meeting of ECS
|
|
| 2002. 11. 19 |
| 발표자 |
Min Cheol Kang, Seung Hwan Cha, Jae Jeong Kim
|
| 제목 |
Organic additives for high selectivity oxide CMP based on ceria slurry
|
| 학회명 |
2002 19th VMIC(IMIC)
|
|
| 2002. 10. 23. |
| 발표자 |
Oh Joong Kwon, Moo Seong Kang, Jae Jeong Kim
|
| 제목 |
Ruthenium Bottom Electrode Prapared by Electroplating for High k DRAM Capacitor
|
| 학회명 |
202nd Meeting of ECS
|
|
| 2002. 10. 21 |
| 발표자 |
Chang Hwa Lee, Jae Jeong Kim
|
| 제목 |
Self-annealing effect of electrolessly deposited copper thin films based on Co(II)-ethylenediamine as a reducing agent
|
| 학회명 |
202nd Meeting of ECS
|
|
| 2002. 09. 29 |
| 발표자 |
Soo-Kil Kim, Chang Hwa Lee, Yong Shik Kim, Jae Jeong Kim
|
| 제목 |
Investigation of Electrolessly Plated Copper Seed Layers for Copper Electrodeposition Applicable to ULSI Interconnection
|
| 학회명 |
9th APPChE Congress and CHEMECA 2002
|
|
| 2001. 11. 27 |
| 발표자 |
Joon-Mo Seo, Soo-Kil Kim, Jae Jeong Kim
|
| 제목 |
Electroplated Ag Thin Film for ULSI Interconnection Material
|
| 학회명 |
MRS 2001 Fall Meeting
|
|
| 2001. 09. 25 |
| 발표자 |
Yong Shik Kim, Soo-Kil Kim, Jea Jeong Kim
|
| 제목 |
Co-suppression behavior of polyethylene glycol and chloride ion at copper electrodeposition
|
| 학회명 |
2001 18th VMIC(IMIC)
|
|
| 2001. 09. 25 |
| 발표자 |
Han-Hum Park, Seung-Hwan Cha, Chang-Deok Lee, Jae Jeong Kim
|
| 제목 |
The optimum content of Mg in electroless silver plating for microelectronic interconnection
|
| 학회명 |
2001 18th VMIC(IMIC)
|
|
| 2001. 05. 28 |
| 발표자 |
Doo Hwan Jung, Moon Soo Kim, Sang Hyun Kim, Do Young Yoon, Jae Jeong Kim
|
| 제목 |
Surface Roughness Reducing Effect of Iodine Sources (CH3I, C2H5,I) on Ru and RuO2 composite Film Grown by MOCVD
|
| 학회명 |
2001 The Second Asian Conference on Chemical Vapor Deposition
|
|
| 2001. 03. 05 |
| 발표자 |
Seung Hwan Cha, Chang Duk Lee, Jae Jeong Kim
|
| 제목 |
Investigation of EDTA Mechanism in Copper Electroless Plating
|
| 학회명 |
2001 7th DCMIC(IMIC)
|
|
| 2001. 03. 05 |
| 발표자 |
Soo-Kil Kim, Jong-Uk Bae, Jae Jeong Kim
|
| 제목 |
Investigation of Copper Electrodeposition in the Presence of Benzotriazole as a Brightener
|
| 학회명 |
2001 7th DCMIC(IMIC)
|
|
| 2000. 10. 01 |
| 발표자 |
정두환, 윤도영, 김재정?
|
| 제목 |
Ru-MOCVD 공정의 CFD해석 및 Iodine 의 효과 (CFD Analysis of Ru-MOCVD Process: Effect of Iodine)?
|
| 학회명 |
한국화학공학회 2000 가을 학술대회?
|
|
| 2000. 08. 04 |
| 발표자 |
정두환, 김문수, 윤도영, 김재정?
|
| 제목 |
Ru MOCVD에서의 요오드 효과?
|
| 학회명 |
제3회 CVD 심포지움?
|
|
| 2000. 04. 21 |
| 발표자 |
김재정?
|
| 제목 |
초고집적 반도체 세대의 공정 기술 (Semiconductor Processes In ULSI era)?
|
| 학회명 |
한국화학공학회 2000 봄 학술대회?
|
|
| 2000 |
| 발표자 |
Jae Jeong Kim
|
| 제목 |
Front End Process Technology in Chip Process
|
| 학회명 |
ASEAN-ROK Workshop on MICROELECTRONICS TECHNOLOGY
|
|
| 2000 |
| 발표자 |
Jun Yong Kim, Chae Ho Jeong, Nae Hak Park, Sang Bum Han, Jin Won Park, Jae Jeong Kim
|
| 제목 |
Investigation of Aluminum CMP to Apply to Sub-Quarter Micron DRAM Devices
|
| 학회명 |
2000 17thVMIC(IMIC)
|
|
| 1996. 10. 01 |
| 발표자 |
정상철, 박지수, 윤여분, 노재성, 김재정?
|
| 제목 |
Ti-Silicide 형성에 미치는 전세정 효과 (The Effect of Precleaning Treatments on The Formation of Ti-Silicide)?
|
| 학회명 |
한국화학공학회 가을 학술대회?
|
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