▣ Electrodeposition for fabrication the interconnections

▣ Gap-filling with organic additives

▶ The Mechanism of Bottom-up Filling (Superfilling)

▶ Cu Electrodeposition

?

?▶ Ag Electrodeposition

?▶ Through Silicon Via (TSV) Filling for 3D Package (Pulse-Reverse Deposition with Leveler)

▣ Film property improvements using pulse deposition

▶ Pulse Deposition

▶ Film Resistivity Improvements using Pulse Deposition

?